M2GL060T-FCS325

The M2GL060T-FCS325 is an IGLOO2 field programmable gate array (FPGA) IC supplied in a 325-ball TFBGA/FCBGA package. It integrates 56,520 logic elements and approximately 1.87 Mbits of on-chip RAM to support medium-density logic and memory requirements.

With 200 general I/O pins, a 1.14 V to 2.625 V supply range, commercial-grade temperature rating, and surface-mount packaging, this device is intended for embedded and board-level designs that require configurable logic, moderate embedded memory, and flexible I/O counts.

Key Features

• Logic Capacity  56,520 logic elements for implementing combinational and sequential logic functions in programmable hardware.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to store buffers, state, and intermediate data within the FPGA fabric.
• I/O  200 device I/O pins to support a range of peripheral interfaces and board-level connectivity needs.
• Power  Wide supply voltage window of 1.14 V to 2.625 V to accommodate various system power rails and interfacing requirements.
• Package & Mounting  325-TFBGA / FCBGA package (supplier device package: 325-FCBGA, 11×11) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade  Commercial temperature range of 0 °C to 85 °C and commercial device grade for standard embedded applications.
• Environmental Compliance  RoHS compliant construction.

Typical Applications

• Embedded Control Systems  Use the FPGA to implement custom control logic, state machines, and peripheral interfacing where 200 I/O and onboard memory are required.
• Data Buffering and Processing  On-chip memory and logic capacity enable buffering, packet handling, or intermediate data manipulation within systems that require embedded RAM.
• Interface Bridging  200 I/O pins provide flexibility for board-level interface translation, protocol bridging, or peripheral aggregation on compact PCBs.

Unique Advantages

• Substantial Logic Density: 56,520 logic elements provide a balance of capacity for moderate-complexity designs without moving to larger device classes.
• Integrated On-Chip Memory: Approximately 1.87 Mbits of RAM reduces external memory needs for many buffering and state-retention tasks.
• Flexible I/O Count: 200 I/O pins allow integration of multiple peripherals and interfaces directly onto a single FPGA device.
• Wide Supply Range: Support for 1.14 V to 2.625 V supplies aids compatibility with a range of system voltage domains.
• Compact, Surface-Mount Packaging: 325-ball TFBGA/FCBGA package (325-FCBGA, 11×11) enables dense PCB layouts in space-constrained designs.
• RoHS Compliant: Designed to meet environmental compliance requirements for lead-free assembly processes.

Why Choose M2GL060T-FCS325?

The M2GL060T-FCS325 positions itself as a mid-density programmable logic device combining 56,520 logic elements, substantial on-chip RAM, and 200 I/O in a compact 325-ball surface-mount package. Its voltage supply flexibility and commercial temperature rating make it suitable for a wide range of embedded and board-level designs that require configurable logic and moderate embedded memory.

For design teams seeking a programmable solution that balances logic capacity, embedded memory, and connectivity in a RoHS-compliant, surface-mount form factor, the M2GL060T-FCS325 provides a clear specification set to evaluate against system requirements.

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