M2GL060T-FCSG325I

The M2GL060T-FCSG325I is an IGLOO2 field-programmable gate array (FPGA) from Microchip Technology. It integrates 56,520 logic elements and approximately 1.87 Mbits of embedded memory with a 200-pin I/O count in a 325-ball TFBGA/FCBGA package.

Designed for industrial applications, the device supports a wide supply voltage range and an extended operating temperature range to meet the environmental and integration needs of embedded and industrial designs.

Key Features

• Core Logic  56,520 logic elements provide programmable logic capacity for complex custom functions and control logic.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, state machines, and data processing tasks without external memory.
• I/O Capability  200 general-purpose I/O pins to interface with sensors, peripherals, and other system components.
• Power Supply  Flexible operating supply range from 1.14 V to 2.625 V to accommodate a variety of system power architectures.
• Package & Mounting  325-TFBGA / 325-FCBGA (11×11) surface-mount package for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic and 200 I/Os support custom control, sensor interfacing, and signal aggregation in industrial automation systems.
• Embedded Processing  On-chip memory and high logic capacity enable offloading of deterministic tasks and real-time processing in embedded platforms.
• Communications Interfaces  Programmable I/O and sizable logic resources allow implementation of protocol bridging and custom interface logic.

Unique Advantages

• High Logic Density: 56,520 logic elements provide the resources needed for complex programmable logic designs.
• Integrated On‑Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependency on external memory and simplifies BOM.
• Generous I/O Count: 200 I/Os enable direct interfacing to multiple peripherals and sensors without extensive external multiplexing.
• Flexible Power: Wide supply voltage range (1.14–2.625 V) supports diverse system power domains and design choices.
• Industrial Reliability: −40°C to 100°C operating range suits industrial and other thermally demanding deployments.
• Compact Surface-Mount Package: 325-ball TFBGA/FCBGA (11×11) package provides a space-efficient footprint for board-level integration.

Why Choose M2GL060T-FCSG325I?

The M2GL060T-FCSG325I combines substantial logic capacity, embedded memory, and a broad I/O complement in a compact industrial-grade package. Its flexible supply voltage and extended temperature rating make it suitable for embedded and industrial applications that require reliable, field-programmable logic integration.

This device is well suited to designs that need on-chip memory and high logic density while maintaining compact board area and RoHS-compliant manufacturing. It offers a balance of integration and environmental robustness for long-term deployments.

Request a quote or submit an inquiry to get pricing and availability information for the M2GL060T-FCSG325I. Our team can provide lead-time details and support for your design requirements.