M2GL060T-FCSG325

The M2GL060T-FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) provided in a 325-TFBGA / FCBGA package. It delivers a mid-range logic capacity combined with on-chip embedded memory and a broad I/O count, suitable for designs that require significant programmable logic and flexible interfacing.

Key device attributes visible in the part data include 56,520 logic elements, approximately 1.87 Mbits of embedded memory, up to 200 user I/Os, and a commercial operating temperature range of 0 °C to 85 °C. The device supports standard surface-mount assembly in a 325-ball FCBGA (11×11) footprint and operates across a 1.14 V to 2.625 V supply range.

Key Features

• Core Logic  56,520 logic elements provide mid-range capacity for implementing custom digital logic, data path processing, and glue-logic integration.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM for buffering, state storage, and small data sets without external memory.
• I/O Count  Up to 200 user I/Os to support multiple interfaces, peripherals, and system interconnects.
• Power Supply Range  Operates from 1.14 V to 2.625 V, allowing flexibility in system power architectures.
• Package and Mounting  Delivered in a 325-TFBGA / 325-FCBGA (11×11) package for surface-mount PCB assembly and compact system integration.
• Operating Grade  Commercial temperature rating from 0 °C to 85 °C suitable for standard electronics applications.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom Digital Logic  Implement application-specific datapaths, state machines, and control logic using up to 56,520 logic elements and on-chip RAM.
• I/O-Intensive Interfaces  Use the 200 user I/Os to connect multiple peripherals, sensors, or external modules without immediate external bridging.
• Embedded System Glue  Integrate protocol conversion, timing adaptation, and interface aggregation in a single programmable device to reduce board-level complexity.

Unique Advantages

• Balanced Logic and Memory Capacity: The combination of 56,520 logic elements and approximately 1.87 Mbits of RAM supports mid-range integration of logic and buffering without immediate reliance on external memories.
• High I/O Density: Up to 200 user I/Os enable direct connection to numerous peripherals and interfaces, simplifying system partitioning.
• Compact FCBGA Packaging: The 325-ball FCBGA (11×11) package provides a compact footprint for space-constrained designs while supporting surface-mount assembly processes.
• Flexible Power Range: A wide supply voltage window (1.14 V–2.625 V) accommodates various board power schemes and regional power rails.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet standard commercial electronics deployment requirements.
• Regulatory Alignment: RoHS compliance supports environmental and manufacturing requirements for modern electronics supply chains.

Why Choose M2GL060T-FCSG325?

The M2GL060T-FCSG325 positions itself as a practical FPGA choice for designs that need a mid-range balance of logic capacity, embedded memory, and high I/O count within a compact surface-mount FCBGA package. Its commercial temperature rating and RoHS compliance make it a suitable option for mainstream electronic products and prototypes that require reliable programmable logic and dense interfacing.

Engineers and procurement teams looking to consolidate functions, reduce BOM complexity, or add programmable flexibility to their designs will find the M2GL060T-FCSG325 a straightforward option thanks to its clear, verifiable specifications for logic, memory, I/O, package, and power.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the M2GL060T-FCSG325. Our team can assist with ordering quantities and supply options tailored to your project schedule.