M2GL060T-FG676
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 387 1869824 56520 676-BGA |
|---|---|
| Quantity | 378 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 387 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56520 | Number of Logic Elements/Cells | 56520 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL060T-FG676 – IGLOO2 Field Programmable Gate Array (FPGA), 676-BGA
The M2GL060T-FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high-density, programmable logic fabric with a substantial on-chip memory complement and a large I/O count suitable for complex digital designs.
Targeted at commercial-grade applications, this surface-mount FPGA combines 56,520 logic elements with approximately 1.87 Mbits of embedded memory and a flexible supply voltage range to support a variety of system-level integration tasks.
Key Features
- Core Logic 56,520 logic elements for implementing complex digital architectures and custom logic functions.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for state machines.
- I/O Capacity 387 user I/O pins to enable wide peripheral connectivity and parallel interfaces.
- Power Supply Range Operates from 1.14 V to 2.625 V, offering flexibility for different core and I/O voltage domains.
- Package & Mounting 676-ball FBGA in a 27×27 mm footprint, surface-mount package suitable for compact board designs.
- Temperature & Grade Commercial grade operation from 0°C to 85°C for standard commercial-environment deployments.
- Regulatory Compliance RoHS compliant, meeting common environmental requirements for electronic assemblies.
Typical Applications
- Custom Digital Logic Implement glue logic, protocol handling, and custom state machines using the FPGA’s sizable logic element count.
- Embedded System Integration Use on-chip RAM and plentiful I/O to integrate peripheral interfaces and local data buffering within embedded platforms.
- I/O Aggregation and Routing Consolidate and manage multiple parallel and serial interfaces with high I/O capacity for compact system designs.
Unique Advantages
- High Logic Density: 56,520 logic elements enable the implementation of complex functions and multi-block designs without external ASICs.
- Significant Embedded Memory: Approximately 1.87 Mbits of RAM available on-chip reduces dependence on external memory for many buffering and state needs.
- Large I/O Count: 387 user I/Os support extensive peripheral connectivity and flexible signal routing on a single device.
- Flexible Voltage Support: 1.14–2.625 V supply range allows integration with varied system voltage domains.
- Compact, Surface-Mount Package: 676-FBGA (27×27 mm) package provides a high-pin-count solution in a space-efficient footprint.
- Commercial-Grade Reliability: Rated for operation from 0°C to 85°C for typical commercial applications.
Why Choose M2GL060T-FG676?
The M2GL060T-FG676 delivers a balance of logic capacity, embedded memory, and I/O density in a compact 676-FBGA package, making it well suited for engineers who need programmable system integration in commercial environments. Its flexible supply range and RoHS compliance further simplify integration into modern boards.
Backed by Microchip Technology, this IGLOO2 FPGA is appropriate for teams developing scalable digital designs that require on-chip RAM, extensive I/O, and high logic density while maintaining a compact PCB footprint.
Request a quote or submit an inquiry to obtain pricing and availability for the M2GL060T-FG676.

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