M2GL060T-FGG484I

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56520 484-BGA

Quantity 1,316 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56520Number of Logic Elements/Cells56520
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL060T-FGG484I – IGLOO2 Field Programmable Gate Array (FPGA), 56,520 logic elements, 267 I/Os, 484-BGA

The M2GL060T-FGG484I is an IGLOO2 Field Programmable Gate Array (FPGA) IC offering 56,520 logic elements and approximately 1.87 Mbits of embedded memory. Designed as an industrial-grade, surface-mount FPGA, it combines high logic density and ample on-chip RAM with a broad operating temperature and a compact 484-ball BGA package.

Key device characteristics include 267 I/O pins, a wide supply voltage range from 1.14 V to 2.625 V, and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require robust thermal and power flexibility.

Key Features

  • FPGA Core  IGLOO2 Field Programmable Gate Array architecture with 56,520 logic elements for implementing complex digital logic.
  • Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support data buffering, state machines, and small block storage needs.
  • I/O Capability  267 total I/Os to support a broad mix of external interfaces and parallel connectivity.
  • Power Supply Range  Operates from 1.14 V to 2.625 V, providing flexibility for different system power domains.
  • Package and Mounting  484-FPBGA (23 × 23) package, surface-mount assembly in a 484-ball BGA footprint for compact board integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High logic capacity: 56,520 logic elements enable implementation of sizable digital subsystems without external PLD expansion.
  • On-chip memory resources: Approximately 1.87 Mbits of embedded RAM reduce reliance on external memory for moderate buffering and state storage.
  • Extensive I/O count: 267 I/Os provide flexibility for parallel interfaces, control signals, and mixed peripheral connectivity.
  • Wide supply-voltage flexibility: 1.14 V to 2.625 V operation supports integration into diverse power architectures.
  • Industrial temperature range: −40 °C to 100 °C rating supports deployments in thermally demanding environments.
  • Compact BGA footprint: 484-FPBGA (23×23) minimizes PCB area while supporting high pin-count routing.

Why Choose M2GL060T-FGG484I?

The M2GL060T-FGG484I positions itself as a high-density IGLOO2 FPGA option that balances logic capacity, embedded memory, and I/O density within an industrial-temperature, RoHS-compliant package. Its combination of 56,520 logic elements, substantial on-chip RAM, and 267 I/Os makes it a practical choice for engineers needing a compact, robust programmable logic device that can operate across a wide temperature and voltage range.

Selected for designs where board space, thermal endurance, and flexible power domains matter, this FPGA provides a solid platform for integrating complex digital functions while simplifying board-level routing through a 484-ball BGA package.

Request a quote or submit a pricing inquiry to receive availability, lead-time, and ordering information for the M2GL060T-FGG484I.

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