M2GL060T-FGG484

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56520 484-BGA

Quantity 579 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56520Number of Logic Elements/Cells56520
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL060T-FGG484 – IGLOO2 Field Programmable Gate Array (FPGA), 56,520 logic elements

The M2GL060T-FGG484 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers 56,520 logic elements, approximately 1.87 Mbits of embedded memory and 267 I/O in a 484-ball BGA package.

Designed for commercial-grade applications, the device operates from a 1.14 V to 2.625 V supply and across a 0 °C to 85 °C temperature range, providing a high-capacity, compact programmable-logic option for board-level integration.

Key Features

  • Core Logic  56,520 logic elements for implementing complex programmable logic functions.
  • Embedded Memory  Total on-chip RAM of 1,869,824 bits — approximately 1.87 Mbits of embedded memory for local data storage and buffering.
  • I/O Capacity  267 I/O pins to support a broad range of external interfaces and parallel connections.
  • Power Supply  Supports a voltage supply range from 1.14 V to 2.625 V to match diverse system power architectures.
  • Package and Mounting  484-ball FPBGA (23 × 23) package, surface-mount mounting type, suitable for compact, high-density PCB layouts.
  • Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded control and interfacing — Suitable for designs that require programmable logic with up to 267 I/O signals and substantial logic capacity.
  • High-density logic implementations — Enables implementations that need roughly 56,520 logic elements and approximately 1.87 Mbits of on-chip RAM.
  • Compact board-level integration — 484-FPBGA (23×23) surface-mount package supports high pin count in a compact footprint for space-constrained PCBs.

Unique Advantages

  • High logic capacity: 56,520 logic elements allow substantial on-chip logic integration without external CPLDs.
  • Significant embedded memory: Approximately 1.87 Mbits of RAM for local buffering, state storage, and data processing tasks.
  • Extensive I/O count: 267 I/O pins provide flexibility for interfacing with multiple peripherals and buses.
  • Flexible power options: Operates across a 1.14 V to 2.625 V supply range to accommodate various system power domains.
  • Compact BGA package: 484-FPBGA (23 × 23) offers a high pin count in a small footprint for dense PCB designs.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployments.

Why Choose M2GL060T-FGG484?

The M2GL060T-FGG484 combines substantial logic and memory resources with a high I/O count in a compact 484-ball BGA package, making it well suited for commercial applications that require dense programmable logic and flexible interfacing. As an IGLOO2 FPGA from Microchip Technology, it provides a commercially rated option for designers targeting board-level integration with defined power and temperature requirements.

This device is appropriate for customers seeking a scalable, high-capacity FPGA solution for commercial designs where on-chip memory, abundant I/O, and a compact package are primary considerations.

Request a quote or contact sales to obtain pricing and availability for the M2GL060T-FGG484.

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