M2GL060T-FG676I

The M2GL060T-FG676I is an IGLOO2 series Field Programmable Gate Array (FPGA) IC from Microchip Technology supplied in a 676-ball BGA package. It provides a reconfigurable logic fabric with 56,520 logic elements and approximately 1.87 Mbits of embedded memory, making it suitable for designs that require moderate logic density and on-chip RAM.

Targeted at industrial-grade applications, this surface-mount device offers a wide operating temperature range and flexible core supply voltages, enabling deployment in systems that demand reliable, configurable logic and a high I/O count.

Key Features

• Logic Capacity  56,520 logic elements provide a substantial fabric for implementing custom logic, control functions, and glue logic within a single device.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM for local buffering, state storage, and data manipulation without external memory.
• I/O Density  Up to 387 I/O pins accommodate complex interfacing and multiple parallel connections for peripherals and system-level signals.
• Power Supply Range  Flexible voltage support from 1.14 V to 2.625 V to match a variety of system power architectures and I/O voltage domains.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• Package and Mounting  676-FBGA (27 × 27) package in a surface-mount form factor (676-BGA package case) for compact board integration.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Logic and Glue Logic  Use the 56,520 logic elements to implement application-specific control, protocol translation, and interface glue logic on system boards.
• Embedded Memory-Intensive Functions  Leverage approximately 1.87 Mbits of embedded memory for buffering, FIFOs, and local data storage without adding external RAM.
• High I/O Count Systems  Support designs requiring numerous parallel or discrete signals using up to 387 I/Os for sensors, controllers, and peripheral interfaces.

Unique Advantages

• Significant Logic Density: 56,520 logic elements enable consolidation of multiple functions onto a single device, reducing board-level component count.
• On-Chip Memory: Approximately 1.87 Mbits of embedded RAM minimizes dependence on external memory and simplifies PCB routing.
• High I/O Capability: 387 I/Os provide flexibility for complex system interconnect and multiple concurrent interfaces.
• Wide Temperature Range: Industrial-grade operation from −40 °C to 100 °C supports deployment in challenging thermal environments.
• Flexible Power Architecture: Broad supply voltage support (1.14 V to 2.625 V) eases integration with diverse system power domains.
• RoHS Compliant: Meets common environmental compliance expectations for electronic assemblies.

Why Choose M2GL060T-FG676I?

The M2GL060T-FG676I delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 676-FBGA package suited for industrial applications. Its supply voltage flexibility and broad operating temperature range make it a pragmatic choice for designers who need dependable, reconfigurable logic with on-chip resources.

This device is well suited for engineers seeking to consolidate functions, reduce BOM complexity, and maintain thermal and power flexibility in mid-density FPGA deployments while retaining environmental compliance.

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