M2GL060T-FGG676I

The M2GL060T-FGG676I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology offered in a 676-ball BGA package. This industrial-grade FPGA provides a combination of programmable logic, abundant I/O, and embedded RAM suitable for designs that require flexible, reconfigurable digital logic.

With 56,520 logic elements, approximately 1.87 Mbits of embedded memory and up to 387 I/O pins, the device is designed for embedded and industrial applications that need high-density logic, configurable interfaces, and a wide operating temperature range.

Key Features

• Logic Capacity  56,520 logic elements for implementing complex digital functions, custom state machines and protocol handling.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffers, FIFOs and local data storage without external memory.
• I/O Density  Up to 387 I/O pins to support multiple peripherals, parallel interfaces and high-pin-count designs.
• Voltage Supply  Operates across a 1.14 V to 2.625 V supply range to accommodate various core and I/O voltage domains.
• Package & Mounting  Supplied in a 676-FBGA (27 × 27) package for high-density PCB layouts; surface-mount mounting type.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for a wide range of industrial environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial Control and Automation  Leverage the industrial temperature rating and high I/O count for machine control, sensor aggregation and protocol bridging in factory systems.
• Embedded Processing and Glue Logic  Use the abundant logic elements and on-chip RAM to implement custom data paths, interface adaptation and peripheral glue logic in embedded products.
• Communications and Networking  Implement protocol handling, packet buffering and interface conversion where multiple I/Os and local memory are required.

Unique Advantages

• High Logic Density:  56,520 logic elements enable integration of complex functions that reduce external components and simplify board-level design.
• Substantial On-Chip Memory:  Approximately 1.87 Mbits of embedded RAM provides local storage for buffering and state retention without immediate reliance on external memory.
• Rich I/O Resource:  Up to 387 I/Os allow direct interfacing to numerous peripherals, sensors and external devices, minimizing the need for additional I/O expanders.
• Wide Supply Flexibility:  1.14 V to 2.625 V supply range supports multiple voltage domains and design choices for core and I/O signaling.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation and supplied in a robust BGA package suitable for industrial applications.
• RoHS Compliance:  Environmentally compliant manufacturing supports regulatory and procurement requirements.

Why Choose M2GL060T-FGG676I?

The M2GL060T-FGG676I positions itself as a flexible FPGA platform for industrial and embedded designs that require significant logic capacity, plentiful I/O and on-chip memory. Its combination of 56,520 logic elements, approximately 1.87 Mbits of RAM and a 387-pin I/O footprint enables consolidation of discrete logic and interface functions into a single programmable device.

This device is suitable for engineers and procurement teams building scalable, robust systems that benefit from field-programmability, wide operating temperature range and high-density packaging—providing long-term design flexibility within a consistent hardware footprint.

Request a quote or submit an inquiry to check current pricing and availability for the M2GL060T-FGG676I and to discuss how it can fit into your next design.