M2GL060T-FGG676

The M2GL060T-FGG676 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 56,520 logic elements and approximately 1.87 Mbits of embedded memory, delivering a balanced mix of programmable logic and on-chip RAM for a wide range of commercial designs.

Featuring 387 I/O, a 676‑FBGA (27×27) surface-mount package, and a supply voltage range of 1.14 V to 2.625 V, the device is specified for commercial operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Core Logic 56,520 logic elements for implementing custom digital functions and finite-state logic.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM for buffering, FIFOs and small data tables.
• I/O Connectivity 387 user I/O pins to support multiple peripherals and bus interfaces.
• Power Supply Range Operates across a 1.14 V to 2.625 V supply range to match system voltage domains.
• Package & Mounting 676‑FBGA (27×27) package case in a surface-mount BGA format for high-density PCB layouts.
• Temperature & Grade Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant.

Typical Applications

• I/O‑intensive systems — 387 I/O pins provide the connectivity needed for designs that require multiple external interfaces.
• Embedded logic and control — 56,520 logic elements support custom control, protocol translation and glue logic implementations.
• On‑chip buffering and data handling — Approximately 1.87 Mbits of embedded memory for data staging, buffering and small lookup tables.
• Space‑constrained PCB designs — 676‑FBGA (27×27) surface-mount package enables compact, high-density board layouts.

Unique Advantages

• High logic capacity: 56,520 logic elements allow substantial custom logic integration on a single device.
• Significant on‑chip memory: Approximately 1.87 Mbits of RAM reduces dependence on external memory for many functions.
• Extensive I/O: 387 user I/Os simplify connectivity to peripherals and external components.
• Flexible power range: Support for 1.14 V to 2.625 V operation helps align with varied system voltage rails.
• Compact BGA packaging: 676‑FBGA (27×27) surface‑mount package enables high-density board designs.
• RoHS compliant and commercial rated: Meets environmental compliance while supporting 0 °C to 85 °C operation.

Why Choose M2GL060T-FGG676?

The M2GL060T-FGG676 delivers a practical combination of logic density, embedded memory and abundant I/O in a compact BGA package from Microchip Technology. Its electrical and thermal specifications make it suitable for commercial designs that require moderate FPGA capacity, on-chip RAM and extensive peripheral connectivity.

Engineers and procurement teams looking for a RoHS‑compliant IGLOO2 FPGA with a 676‑FBGA footprint, broad supply voltage flexibility and a commercial temperature rating will find the M2GL060T-FGG676 aligns with those needs while keeping board space and external memory requirements minimized.

Request a quote or submit an inquiry to obtain pricing and availability for the M2GL060T-FGG676.