XC2S50-5PQG208I
| Part Description |
Spartan®-II Field Programmable Gate Array (FPGA) IC 140 32768 1728 208-BFQFP |
|---|---|
| Quantity | 1,566 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 140 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 50000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XC2S50-5PQG208I – Spartan®-II Field Programmable Gate Array (FPGA) IC 140 32768 1728 208-BFQFP
The XC2S50-5PQG208I is an AMD Spartan®-II field programmable gate array presented in a 208-pin BFQFP surface-mount package. It integrates 1,728 logic elements, 32,768 bits of on-chip RAM and 140 user I/O pins to support mid-density digital logic, control and interfacing tasks.
Designed for industrial-grade environments, this device supports a supply range of 2.375 V to 2.625 V and an operating temperature range from −40 °C to 100 °C, making it suitable for embedded designs that require durable, reprogrammable logic in a compact package.
Key Features
- Logic Capacity 1,728 logic elements provide mid-density programmable logic resources for custom digital functions and control logic.
- Embedded Memory 32,768 bits of on-chip RAM enable local data buffering and small lookup tables for state machines and signal processing tasks.
- I/O Count 140 user I/O pins support broad interfacing options for sensors, peripherals and external logic.
- Gate Equivalence Approximately 50,000 gates for estimating integration of combinational and sequential logic into a single device.
- Power Operates from a 2.375 V to 2.625 V core supply, useful for designs with defined low-voltage power domains.
- Package & Mounting 208-BFQFP / 208-PQFP (28×28) package in a surface-mount form factor for compact PCB implementations.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet extended-temperature embedded applications.
- Regulatory Compliance RoHS compliant, supporting lead-free manufacturing requirements.
Typical Applications
- Industrial Control Implements custom control logic and I/O aggregation in automation and process control equipment using industrial temperature-rated operation.
- Embedded Interfaces Provides programmable glue logic and protocol interfacing with 140 I/O pins for coordinating sensors, actuators and peripherals.
- Signal Processing Hosts compact data buffering and logic for filtering, state machines and timing-critical operations using on-chip RAM and logic elements.
- Prototyping and Development Serves as a reprogrammable platform for validating custom logic and system designs in a compact BFQFP package.
Unique Advantages
- Balanced Integration: Combines 1,728 logic elements with 32,768 bits of RAM and 140 I/O to reduce external component count and simplify board-level design.
- Industrial-Ready: Specified for −40 °C to 100 °C operation, enabling reliable deployment in extended-temperature embedded systems.
- Compact Surface-Mount Package: The 208-BFQFP (28×28) package supports space-constrained PCBs while providing substantial I/O.
- Low-Voltage Core: Narrow supply window (2.375 V–2.625 V) facilitates predictable power budgeting in tightly specified power domains.
- RoHS Compliant: Meets lead-free manufacturing requirements for modern assembly processes.
- Manufacturer Backing: Produced by AMD, providing traceability to a recognized FPGA product line.
Why Choose XC2S50-5PQG208I?
The XC2S50-5PQG208I positions itself as a mid-density Spartan®-II FPGA offering a practical balance of logic resources, embedded RAM and I/O in a compact, surface-mount BFQFP package. Its industrial temperature rating and RoHS compliance make it suitable for embedded designs that require durable, reprogrammable logic without sacrificing board space.
This device is a fit for engineers and procurement teams seeking a field-programmable solution for control, interfacing and modest signal-processing tasks where predictable power characteristics, ample I/O and on-chip memory are important design considerations.
Request a quote or submit a pricing and availability inquiry for the XC2S50-5PQG208I to receive lead time and purchase information tailored to your project needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








