XC2S50-5FGG256I

The XC2S50-5FGG256I is a Spartan®-II field programmable gate array (FPGA) from AMD designed for industrial-grade embedded logic applications. It provides a compact, surface-mount 256-ball FBGA package and combines up to 384 configurable logic blocks, approximately 1,728 logic elements, and 32,768 bits of on-chip RAM to address moderate-density logic and I/O requirements.

With a supply range of 2.375 V to 2.625 V, 176 user I/O, and an operating temperature range of −40 °C to 100 °C, the device is suitable for industrial environments that require reliable programmability and integration in constrained board space.

Key Features

• Core Logic 384 configurable logic blocks (CLBs) providing approximately 1,728 logic elements and a total gate equivalence of about 50,000 gates for implementing medium-complexity digital functions.
• Embedded Memory On-chip memory totaling 32,768 bits to store look-up tables, state machines, and small data buffers directly within the FPGA fabric.
• High I/O Count 176 user I/O pins to support multiple parallel interfaces and peripheral connections in a single device.
• Package and Mounting Supplied in a 256-ball BGA/FBGA (17 × 17) surface-mount package to maximize pin density while minimizing PCB footprint.
• Power Operates from a core supply range of 2.375 V to 2.625 V, enabling predictable power budgeting for embedded designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet requirements for many industrial applications.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Implement control logic, signal conditioning, and coordination between sensors and actuators using the device’s logic fabric and robust operating temperature range.
• Embedded Processing Use as a customizable hardware accelerator or glue logic to offload deterministic tasks in embedded systems leveraging the available logic elements and on-chip memory.
• I/O Expansion and Protocol Bridging Support multiple parallel interfaces and custom protocol conversion with 176 user I/O pins for flexible connectivity.
• Prototyping and Low-to-Medium Density Designs Rapidly iterate hardware functions and validate digital designs that fit within the device’s gate and logic element capacity.

Unique Advantages

• Balanced Logic and Memory Capacity: Delivers a combination of approximately 1,728 logic elements and 32,768 bits of RAM for mixed logic-and-memory functions without external RAM.
• High Pin Count in a Compact Package: 176 I/O in a 256-FBGA (17×17) package reduces PCB area while preserving connectivity for complex boards.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to support deployments in temperature-variable industrial environments.
• Predictable Power Envelope: Narrow supply window (2.375 V–2.625 V) simplifies power-supply design and voltage margining.
• Regulatory-Friendly: RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose XC2S50-5FGG256I?

The XC2S50-5FGG256I positions itself as a practical FPGA choice for engineers needing a mid-density, industrial-grade programmable device with a high I/O count and modest on-chip memory. Its combination of CLBs, logic elements, and embedded RAM makes it suitable for designs that require flexible hardware customization without a large device footprint.

For teams focused on board space efficiency, predictable power budgets, and operation across a wide temperature range, this Spartan®-II FPGA offers a well-balanced option that integrates core digital functions and I/O in a single, manufacturable package.

If you need pricing, availability, or want to request a quote for the XC2S50-5FGG256I, submit a request and our team will respond with the next steps for procurement and lead-time information.