XC2S50-5FGG256C

The XC2S50-5FGG256C is a Spartan®-II Field Programmable Gate Array (FPGA) provided in a 256-ball BGA package. It delivers moderate logic capacity with integrated on-chip RAM and a high I/O count for commercial embedded applications.

Designed for commercial-grade systems, this device combines approximately 1,728 logic elements, about 32 Kbits of embedded RAM, and 176 I/O pins in a compact surface-mount 256-FBGA (17×17) package. It supports a core supply range of 2.375 V to 2.625 V and operates across a 0 °C to 85 °C temperature range.

Key Features

• Core Logic Capacity  Approximately 1,728 logic elements and a gate density of 50,000 gates provide a balanced resource set for mid-density digital designs.
• Embedded Memory  Approximately 32 Kbits of on-chip RAM for local buffering, state storage, and small data-path implementations.
• I/O Count and Connectivity  176 user I/O pins support a wide range of external interfacing and signal routing needs in a single device.
• Package and Mounting  256-ball FBGA (17×17) package in a surface-mount form factor enables compact board integration and robust soldered connections.
• Power  Nominal supply range of 2.375 V to 2.625 V allows straightforward power-supply design for the device core.
• Commercial Temperature Range  Specified to operate from 0 °C to 85 °C, suitable for commercial environment deployments.
• Regulatory Compliance  RoHS-compliant construction supports environmental and manufacturing requirements for lead-free assemblies.

Typical Applications

• Commercial Embedded Systems  Custom digital logic and control functions in consumer and commercial electronic products that require moderate gate capacity and compact packaging.
• I/O Consolidation and Interface Bridging  High I/O count enables consolidation of multiple interfaces or expansion of host controller I/O in space-constrained designs.
• On-Board Data Buffering  Approximately 32 Kbits of embedded RAM supports local buffering and small data-path implementations for real-time processing tasks.

Unique Advantages

• Balanced Logic Density:  About 1,728 logic elements and 50,000 gates provide sufficient capacity for many mid-range logic designs without excessive silicon overhead.
• High I/O in a Compact Footprint:  176 user I/O pins in a 256-FBGA (17×17) package enable complex interfacing while maintaining a small board area.
• Integrated RAM for Local Storage:  Approximately 32 Kbits of on-chip memory reduces the need for external RAM for modest buffering and state retention.
• Commercial-Grade Suitability:  Rated for 0 °C to 85 °C operation, matching common commercial product development and deployment environments.
• RoHS-Compliant:  Manufactured to meet RoHS requirements for lead-free assembly and environmental compliance.
• Simplified Board Integration:  Surface-mount 256-FBGA package supports modern PCB assembly processes and compact system designs.

Why Choose XC2S50-5FGG256C?

The XC2S50-5FGG256C positions itself as a practical FPGA choice for designers needing moderate logic resources, a substantial I/O complement, and on-chip RAM in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial embedded applications.

This device is well matched to projects that require a balance of gate density, I/O capability, and compact board-level integration—offering predictable electrical requirements with a defined supply range of 2.375 V to 2.625 V and straightforward surface-mount placement in a 256-FBGA (17×17) package.

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