XC2S50-5FG256C

The XC2S50-5FG256C is a Spartan®-II field programmable gate array (FPGA) in a 256-ball BGA package designed for commercial applications. It provides 1,728 logic elements, approximately 32,768 bits (≈0.033 Mbits) of embedded RAM, and 176 user I/O pins, enabling mid-density programmable logic integration.

Packaged as a 256-FBGA (17×17) surface-mount device with a nominal core supply range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 85 °C, this device targets commercial designs that require configurable logic, moderate on-chip memory, and a high I/O count in a compact footprint. The part is RoHS compliant.

Key Features

• FPGA Core — Spartan®-II architecture with 1,728 logic elements and approximately 50,000 gates for mid-density programmable logic implementation.
• On-Chip Memory — 32,768 bits of embedded RAM (approximately 0.033 Mbits) to support buffering, small data tables, and state storage.
• I/O Capability — 176 user I/O pins to support multiple external interfaces and parallel signal connections.
• Package & Mounting — 256-FBGA (17×17) package in a surface-mount form factor for compact board-level integration.
• Power — Core supply voltage range of 2.375 V to 2.625 V to match system power domains.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Embedded and Control Systems — Implement control logic and interface glue using 1,728 logic elements and 176 I/Os for commercial embedded designs operating within 0 °C to 85 °C.
• Communications and I/O Bridging — Use the high I/O count to implement protocol translation, parallel-to-serial interfaces, and custom bus logic in mid-density applications.
• Prototyping and Evaluation — Evaluate custom logic functions and small on-chip memories in a compact 256-FBGA package suitable for development boards and prototypes.

Unique Advantages

• Balanced Logic Density: 1,728 logic elements provide a balance between capacity and area for mid-range designs without over-provisioning.
• Integrated Memory: 32,768 bits of embedded RAM enable local data storage and buffering without external memory for small-to-moderate datasets.
• High I/O Count: 176 user I/Os simplify external device interfacing and reduce the need for additional I/O expanders.
• Compact BGA Footprint: 256-FBGA (17×17) offers a space-efficient package for board designs that require dense placement and surface-mount assembly.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with general-purpose commercial electronics deployments.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious designs.

Why Choose XC2S50-5FG256C?

The XC2S50-5FG256C positions itself as a mid-density, commercially graded FPGA solution that combines a modest logic element count, on-chip RAM, and a generous I/O complement in a compact 256-FBGA package. Its electrical and thermal specifications—core supply range of 2.375 V to 2.625 V and an operating range of 0 °C to 85 °C—make it suitable for a wide range of commercial embedded designs where board space and I/O integration are important.

This part is well suited for engineers and procurement teams seeking a programmable logic device that offers measurable on-chip memory, a high pin count for interfacing, and RoHS compliance. It delivers a straightforward platform for implementing custom logic, protocol bridging, and control functions with predictable commercial-grade performance.

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