XC2S400E-6FGG456C

IC FPGA 329 I/O 456FBGA
Part Description

Spartan®-IIE Field Programmable Gate Array (FPGA) IC 329 163840 10800 456-BBGA

Quantity 1,645 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O329Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits163840

Overview of XC2S400E-6FGG456C – Spartan®-IIE Field Programmable Gate Array (FPGA)

The XC2S400E-6FGG456C is a Spartan®-IIE family FPGA from AMD, delivered in a 456-ball BGA package. It combines mid-range logic capacity with embedded memory and a large I/O count for cost-sensitive, reprogrammable digital designs.

Built on the Spartan-IIE architecture, the device is positioned for applications that require field reprogrammability, flexible interfacing, and compact BGA packaging while operating within commercial temperature and low-voltage supply ranges.

Key Features

  • Logic Capacity  Approximately 10,800 logic elements providing a programmable fabric sized for mid-range designs; organized as 2,400 CLBs.
  • Embedded Memory  Total on-chip RAM of 163,840 bits — approximately 0.16 Mbits of embedded memory for block and distributed RAM use.
  • I/O and System Gates  329 user I/O pins and a device gate-equivalent of 400,000 system gates to support broad interfacing and system integration.
  • Clocking and Architecture (Family)  Spartan-IIE family features include dedicated DLLs and global clock distribution for controlled clocking and predictable timing (as described in the Spartan-IIE family data sheet).
  • Packaging  456-ball BGA (supplier package: 456-FBGA, 23×23) for compact, high-density board integration.
  • Power  Core supply voltage range specified from 1.71 V to 1.89 V for low-voltage system integration.
  • Commercial Temperature  Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Standards & Compliance  RoHS compliant; family datasheet documents comprehensive I/O standard support and system-level features.

Typical Applications

  • Cost‑sensitive digital systems  Use the XC2S400E-6FGG456C as a reprogrammable alternative to mask-programmed logic where mid-range logic and embedded RAM are required.
  • Interface bridging and protocol glue  High I/O count supports protocol conversion, bus arbitration, and custom interface logic in compact BGA form factors.
  • Embedded control and prototyping  Programmability and on-chip memory make it suitable for development platforms, control logic, and iterative hardware designs.
  • System-level integration  Leverage the Spartan-IIE family’s clocking and memory features to implement timing-sensitive system functions and memory buffering.

Unique Advantages

  • Mid-range logic with compact packaging: 10,800 logic elements in a 456-ball BGA provide a balance of capacity and PCB footprint for space-constrained designs.
  • Substantial on-chip memory: Approximately 0.16 Mbits of embedded RAM reduces external memory dependence for many control and buffering tasks.
  • Large I/O resource: 329 I/O pins enable extensive peripheral and bus connectivity without extensive external glue logic.
  • Low-voltage core operation: 1.71 V–1.89 V supply range supports integration with low-voltage system domains.
  • Field reprogrammability: Spartan-IIE family programmability allows in-field updates and design revisions without hardware replacement.
  • RoHS compliance: Meets lead-free environmental requirements for modern electronic assemblies.

Why Choose XC2S400E-6FGG456C?

The XC2S400E-6FGG456C offers a practical combination of programmable logic, embedded memory, and a high I/O count in a compact BGA package for commercial-temperature applications. Its placement in the Spartan-IIE family provides access to architecture-level features such as dedicated clock control and hierarchical memory described in the family data sheet.

This device is suited for engineers and procurement teams developing cost-conscious, reprogrammable systems that require reliable mid-range logic capacity, flexible interfacing, and compact board-level integration.

Request a quote or submit an RFQ to obtain pricing and availability for the XC2S400E-6FGG456C for your next design.

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