XC2S300E-6FTG256C

The XC2S300E-6FTG256C is a Spartan®-IIE Field Programmable Gate Array (FPGA) IC from AMD, packaged in a 256‑ball LBGA. It integrates approximately 6,912 logic elements with on-chip memory and a rich I/O count, providing a flexible programmable fabric for commercial electronic designs.

With 182 user I/Os, 65,536 total RAM bits, and a nominal core supply range of 1.71–1.89 V, this device targets cost-sensitive commercial applications that require moderate logic density, ample I/O, and reconfigurable hardware capability within a compact surface-mount 256‑LBGA footprint.

Key Features

• Logic Capacity  Approximately 6,912 logic elements (1,536 CLB equivalents reported), enabling mid-range FPGA designs and glue-logic integration.
• Embedded Memory  65,536 total RAM bits of on-chip memory (approximately 64 Kbits) for small data buffers, FIFOs, and control state storage.
• I/O Resources  182 user I/Os to support multiple parallel interfaces, sensor networks, or bus bridging in compact systems.
• System Gate Count  Rated at 300,000 system gates for topology planning and resource budgeting.
• Supply Voltage  Core voltage specified at 1.71 V to 1.89 V for compatibility with target power rails and design planning.
• Package and Mounting  256‑LBGA (supplier package: 256‑FTBGA, 17×17) in a surface-mount package suitable for high-density PCB designs.
• Commercial Temperature Grade  Operating temperature range of 0 °C to 85 °C for commercial-environment deployments.
• In‑System Reprogrammability  Spartan‑IIE family-level capability for in-field updates and design iteration without hardware replacement (as described in the family datasheet).
• RoHS Compliant  Material/lead-free compliance for modern manufacturing and regulatory requirements.

Typical Applications

• Embedded Control  Mid-density logic and on-chip RAM make this FPGA suitable for control logic, protocol handling, and glue logic in commercial equipment.
• Interface Bridging  The high I/O count supports bridging between multiple parallel and serial interfaces in compact designs.
• Prototyping and Development  Reprogrammability and moderate logic resources allow rapid iteration for proof-of-concept and low-volume custom hardware.

Unique Advantages

• Balanced Logic and I/O  Combines ~6,912 logic elements with 182 I/Os to support designs that need both logic density and external connectivity without larger, more expensive packages.
• On-chip RAM for Control and Buffers  65,536 bits of embedded memory provide localized storage for state machines, small FIFOs, and buffering without external RAM.
• Compact, Surface‑Mount Package  256‑LBGA (17×17 FTBGA) enables high-density PCB integration while maintaining a manageable thermal and mechanical footprint.
• Commercial‑Grade Temperature Range  Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic product requirements.
• RoHS Compliance  Designed for modern manufacturing flows with material compliance for global production.

Why Choose XC2S300E-6FTG256C?

The XC2S300E-6FTG256C positions itself as a practical FPGA choice for commercial designs that require mid-range programmable logic, substantial I/O, and on-chip memory in a compact LBGA package. Its combination of approximately 6,912 logic elements, 182 I/Os, and 65,536 bits of embedded RAM delivers a capable platform for control, interfacing, and prototyping tasks.

This device is well-suited to engineers and teams seeking a reprogrammable, RoHS-compliant FPGA option that fits into surface-mount assemblies and operates across standard commercial temperature ranges. The part is appropriate for projects where moderate logic capacity and flexible I/O allocation are key considerations.

Request a quote or submit an inquiry to purchase the XC2S300E-6FTG256C and evaluate how it fits your next commercial FPGA design.