XC2S30-6PQ208C

The XC2S30-6PQ208C is a commercial-grade Spartan®-II field programmable gate array (FPGA) from AMD. It provides a mid-range combination of logic density, embedded RAM, and I/O in a 208-BFQFP surface-mount package suitable for compact digital designs.

Key on-chip resources include 972 logic elements, 216 CLBs and approximately 24,576 bits of RAM, with up to 140 I/O pins and an estimated 30,000 gate capacity. The device operates from 2.375 V to 2.625 V and is specified for 0 °C to 85 °C operation. It is RoHS compliant.

Key Features

• Core Logic  972 logic elements and 216 configurable logic blocks (CLBs) provide moderate-capacity programmable logic for custom digital functions.
• Embedded Memory  Approximately 24,576 bits of on-chip RAM for buffering, small lookup tables, and state storage.
• I/O Resources  Up to 140 user I/O pins to support multiple peripherals and external interfaces.
• Gate Count  Approximately 30,000 gates, enabling a range of small- to mid-scale logic implementations.
• Power  Single-supply operation in the 2.375 V to 2.625 V range.
• Package & Mounting  208-BFQFP package (208-PQFP, 28 × 28) in a surface-mount form factor for PCB integration.
• Operating Conditions & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Implement user-defined combinational and sequential logic using the device's logic elements and CLBs.
• I/O bridging and interface control  Use the 140 I/O pins to handle multiple external peripherals and signal routing in compact systems.
• Embedded buffering and small on-chip memory  Leverage the approximately 24,576 bits of RAM for buffering, small FIFOs, or lookup table storage.

Unique Advantages

• Balanced logic density: 972 logic elements and 216 CLBs provide a practical capacity for compact, custom digital designs without excessive board-level complexity.
• On-chip memory reduces BOM: Approximately 24,576 bits of embedded RAM can reduce or eliminate the need for small external memory components.
• High I/O count: 140 I/O pins simplify external interfacing and reduce the need for additional I/O expanders or glue logic.
• Surface-mount package: The 208-BFQFP (28 × 28) package supports standard SMT assembly processes for compact PCBs.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployments.
• AMD manufacturing: Produced by AMD, providing continuity with the Spartan®-II product family.

Why Choose XC2S30-6PQ208C?

The XC2S30-6PQ208C positions itself as a commercially specified, mid-density FPGA for engineers and designers who need a compact, programmable solution with moderate logic capacity, on-chip RAM, and substantial I/O in a surface-mount 208-BFQFP package. Its combination of approximately 30,000 gates, 972 logic elements, and approximately 24,576 bits of RAM makes it suitable for compact embedded designs, prototyping, and control/interface applications that require integrated logic and memory.

Backed by AMD manufacturing and RoHS compliance, the device offers a practical balance of integration and board-level simplicity for commercial product development and small- to medium-volume production runs.

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