XC2S30-6CS144C

The XC2S30-6CS144C is a Spartan®-II family Field Programmable Gate Array (FPGA) in a 144-ball thin fine-pitch BGA package. It provides a mid-density mix of logic, embedded memory, and I/O suitable for commercial-grade embedded designs that require on-chip customization and flexible I/O.

With 972 logic elements, approximately 24.6 kbits of embedded RAM and 92 user I/O, this device targets compact, programmable logic tasks where board space, I/O count and defined supply/temperature ranges are primary considerations.

Key Features

• Core Logic — 972 logic elements and an estimated 30,000 gates provide a mid-density programmable fabric for custom digital functions and control logic.
• Embedded Memory — Approximately 24,576 bits of on-chip RAM support small buffers, FIFOs and intermediate data storage for control and signal tasks.
• I/O Capability — 92 user I/O pins allow flexible interfacing with peripherals, sensors and external logic in a single device.
• Power — Specified core supply range of 2.375 V to 2.625 V for integration into regulated power domains.
• Package and Mounting — 144-TFBGA / CSPBGA package (supplier package: 144-LCSBGA 12×12) in a surface-mount form factor for compact PCB layouts.
• Operating Range — Commercial temperature rating with an operating range of 0 °C to 85 °C for typical commercial applications.
• Environmental Compliance — RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and peripheral interfacing in commercial equipment where programmable logic simplifies board design.
• Prototyping and Development — Use the device for mid-density prototype builds that require reprogrammable logic and moderate on-chip memory.
• Interface Bridging — Serve as a flexible glue-logic or interface bridge between multiple digital subsystems thanks to its 92 I/O pins.
• Control and Sequencing — Implement deterministic control sequences and state machines utilizing the available logic elements and embedded RAM.

Unique Advantages

• Balanced Logic Density: 972 logic elements and ~30,000 gates offer sufficient capacity for mid-density designs without excess overhead.
• Compact BGA Package: 144-ball TFBGA reduces PCB footprint while maintaining a high I/O count for dense board layouts.
• Defined Power Envelope: Core voltage range (2.375 V–2.625 V) simplifies power supply design and verification.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C to match typical commercial deployment environments.
• RoHS Compliant: Supports environmental compliance requirements for modern electronics assembly.

Why Choose XC2S30-6CS144C?

The XC2S30-6CS144C offers a practical mix of programmable logic, embedded RAM and I/O in a compact BGA package, positioned for commercial embedded applications that need reconfigurable digital logic without excessive density. Its defined supply and temperature ranges make it straightforward to integrate into regulated commercial designs.

This device is well suited to engineers and procurement teams looking for a cost-conscious, mid-density FPGA solution that supports a range of control, interfacing and prototyping tasks while meeting RoHS environmental requirements.

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