XC2S30-6CSG144C

IC FPGA 92 I/O 144CSBGA
Part Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 92 24576 972 144-TFBGA, CSPBGA

Quantity 260 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-LCSBGA (12x12)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-TFBGA, CSPBGANumber of I/O92Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells972
Number of Gates30000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of XC2S30-6CSG144C – Spartan®-II FPGA, 972 logic elements, 92 I/O, 144-TFBGA

The XC2S30-6CSG144C is a Spartan®-II Field Programmable Gate Array (FPGA) from AMD provided in a 144-TFBGA (CSPBGA) package. This device offers a mid-range resource balance with 972 logic elements and 24,576 bits of on-chip RAM, targeting designs that require configurable logic, embedded memory, and a moderate number of I/O signals within a compact surface-mount package. Its commercial-grade temperature range and RoHS compliance make it suitable for general electronic and embedded system applications operating between 0 °C and 85 °C.

Key Features

  • Core Logic — 972 logic elements organized across 216 configurable logic blocks (CLBs), providing a fixed amount of programmable logic resources for custom digital designs.
  • Embedded Memory — Approximately 0.025 Mbits of embedded memory (24,576 total RAM bits) for on-chip data buffering and small lookup tables.
  • I/O Capacity — 92 user I/O pins to support multiple peripheral interfaces and board-level routing requirements.
  • Gate Count — Approximately 30,000 gates for implementing moderate-complexity logic functions.
  • Power — Operates from a supply voltage range of 2.375 V to 2.625 V, enabling predictable power design around the core supply domain.
  • Package & Mounting — Supplied in a 144-TFBGA, CSPBGA package (supplier device package: 144-LCSBGA, 12×12); surface mount mounting type for compact PCB assembly.
  • Temperature & Grade — Commercial grade operation with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Unique Advantages

  • Balanced resource mix: Combines 972 logic elements with on-chip RAM to support a variety of mid-density programmable logic tasks without external memory for small data needs.
  • Compact, board-friendly package: 144-TFBGA CSPBGA packaging in a 12×12 footprint helps save PCB space while supporting surface-mount assembly processes.
  • Flexible I/O count: Ninety-two I/O pins provide room for multiple interfaces and signal routing options on modestly complex boards.
  • Predictable power domain: A defined core supply range (2.375 V–2.625 V) helps simplify power-supply planning and margining in system designs.
  • Commercial grade and compliant: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard electronic product requirements.

Why Choose XC2S30-6CSG144C?

The XC2S30-6CSG144C is positioned for designers needing a Spartan®-II FPGA with modest logic capacity, embedded memory, and a compact BGA footprint. Its mix of 972 logic elements, approximately 24,576 bits of on-chip RAM, and 92 I/O pins make it suitable for embedded controllers, interface glue logic, and other moderate-complexity programmable tasks where space and predictable power requirements matter.

For teams focused on reliable, commercially graded FPGA integration with RoHS compliance, this device provides a straightforward, verifiable set of capabilities backed by AMD's Spartan®-II family pedigree.

Request a quote or submit an inquiry to receive pricing and availability for the XC2S30-6CSG144C. Our sales team can provide lead-time, volume pricing, and assistance with procurement details.

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