XC2S30-6TQG144C

The XC2S30-6TQG144C is an AMD Spartan®-II FPGA in a 144‑LQFP surface-mount package designed for moderate-density programmable logic applications. It integrates 972 logic elements, 24,576 bits of on-chip RAM and 92 user I/O pins, providing a compact platform for custom digital functions in commercial-temperature systems.

With a nominal supply range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 85 °C, this device is suited for embedded control, prototyping, and interface bridging where a balance of logic capacity, I/O count, and package density is required.

Key Features

• Core Logic  972 logic elements supporting up to 30,000 equivalent gates for implementing custom combinational and sequential logic.
• Embedded Memory  24,576 bits of on-chip RAM for buffering, small FIFO structures, and local data storage.
• I/O Resources  92 user I/O pins to interface directly with peripherals, sensors and external logic devices.
• Package and Mounting  144‑LQFP package (supplier device package: 144‑TQFP 20×20) in a surface-mount form factor for space-constrained PCBs.
• Power  Operates from a supply voltage range of 2.375 V to 2.625 V to match system power rails.
• Operating Range and Grade  Commercial grade operation with a temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.

Typical Applications

• Embedded Control  Implement custom control logic, state machines and timing-critical glue logic for appliances and consumer electronics within commercial temperature limits.
• Interface Bridging  Translate and buffer signals between digital peripherals using the device’s 92 I/O pins and on-chip logic.
• Prototyping and Development  Rapidly validate algorithms and hardware designs that require moderate logic density and local RAM resources.
• Custom Peripheral Logic  Implement protocol handlers, simple packet processing, or peripheral accelerators leveraging the device’s logic and memory resources.

Unique Advantages

• Balanced Logic and Memory: 972 logic elements combined with 24,576 bits of embedded RAM enable compact implementations of control and buffering functions without external memory.
• Generous I/O Count: 92 user I/O pins support multiple peripheral connections and flexible board-level interfacing.
• Compact Surface-Mount Package: 144‑LQFP surface-mount packaging provides a small footprint for space-constrained PCBs while maintaining accessible pinout.
• Defined Power Envelope: Narrow supply range (2.375 V to 2.625 V) simplifies power rail design and integration into existing systems.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant for common commercial applications and regulatory considerations.

Why Choose XC2S30-6TQG144C?

The XC2S30-6TQG144C positions itself as a practical choice for designers needing a moderate-density FPGA with a good balance of logic, memory and I/O in a compact LQFP package. Its specification set supports a range of commercial embedded and interface applications where board space, power compatibility and RoHS compliance are important.

This device is suitable for design teams and procurement seeking a reliable Spartan®-II FPGA option from AMD that delivers predictable electrical and thermal characteristics for production deployments within the stated operating range.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the XC2S30-6TQG144C.