XC2S300E-6PQ208C
| Part Description |
Spartan®-IIE Field Programmable Gate Array (FPGA) IC 146 65536 6912 208-BFQFP |
|---|---|
| Quantity | 1,328 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 300000 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XC2S300E-6PQ208C – Spartan®-IIE FPGA, 6912 Logic Elements, 208-BFQFP
The XC2S300E-6PQ208C is a Spartan®-IIE family field-programmable gate array (FPGA) offered in a 208-BFQFP surface-mount package. It combines a mid-range logic fabric with embedded memory and flexible I/O to support programmable digital logic, interface bridging, and prototype or production designs that benefit from in-system reprogrammability.
As a member of the Spartan-IIE family, the device is designed to provide reprogrammable logic resources with predictable timing and system-level features such as dedicated clock control. It targets commercial-grade applications that operate within a 0 °C to 85 °C temperature range and a core supply window of 1.71 V to 1.89 V.
Key Features
- Core Logic 6,912 logic elements (cells) and 1,536 configurable logic blocks provide mid-range programmable logic capacity suitable for a wide range of designs.
- Embedded Memory Approximately 65,536 bits of on-chip RAM for block and distributed memory usage in control, buffering, and state-machine applications.
- I/O Capacity 146 general-purpose I/O pins to support multiple interfaces and peripheral connections from a single device package.
- System Gate Equivalent Approximate system density of 300,000 gates for system-level integration and consolidation of discrete logic functions.
- Clocking and Timing Family-level features include delay-locked loop (DLL) support and multi-net global clock distribution for deterministic clocking and phase control.
- Package and Mounting 208-BFQFP (208-PQFP 28×28 footprint) surface-mount package for PCB assembly and space-efficient board layouts.
- Power and Temperature Recommended supply range of 1.71 V to 1.89 V and commercial operating temperature from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for lead-free assembly and regulatory alignment with common electronic manufacturing requirements.
Typical Applications
- ASIC Replacement and Prototyping Implement replaceable or upgradable system logic to avoid mask-programmed ASIC costs and enable field updates.
- Interface Bridging Use the device to consolidate interface logic and glue logic between peripherals or legacy and modern interfaces.
- Embedded Control and State Machines Implement deterministic control logic, timing-critical state machines, and on-chip buffering using the available logic and embedded RAM.
- Performance-Critical Digital Designs Deploy where predictable timing and dedicated clock control (DLLs) are required for synchronous designs.
Unique Advantages
- Reprogrammable Hardware In-system reprogrammability enables design updates and field upgrades without hardware replacement.
- Balanced Logic and Memory Combines thousands of logic elements with on-chip RAM to reduce external memory needs for many embedded tasks.
- Flexible I/O Count 146 I/O pins allow multiple peripherals and interfaces to be supported from a single package, simplifying board-level integration.
- Commercial Temperature Range Rated for 0 °C to 85 °C operation to match typical commercial embedded and consumer applications.
- RoHS-Compliant Packaging Supports lead-free assembly processes and aligns with common environmental manufacturing requirements.
- Compact Surface-Mount Package 208-BFQFP surface-mount package supports dense PCB layouts while maintaining a high pin count.
Why Choose XC2S300E-6PQ208C?
The XC2S300E-6PQ208C delivers a practical combination of logic capacity, embedded memory, and flexible I/O in a commercial-grade, RoHS-compliant surface-mount package. It is well suited for designers who need in-system reprogrammability, predictable clock control, and the ability to consolidate multiple discrete components onto a single FPGA-based solution.
This part is targeted at teams developing mid-range programmable systems, hardware prototypes that require field updates, and embedded designs that benefit from a balance of logic density and on-chip memory while operating within standard commercial temperature and voltage ranges.
Request a quote or submit a pricing inquiry to check availability and lead times for the XC2S300E-6PQ208C.

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