XC2S50-5FG256I
| Part Description |
Spartan®-II Field Programmable Gate Array (FPGA) IC 176 32768 1728 256-BGA |
|---|---|
| Quantity | 1,024 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 50000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XC2S50-5FG256I – Spartan®-II Field Programmable Gate Array (FPGA), 1728 logic elements, 256-BGA
The XC2S50-5FG256I is a Spartan®-II Field Programmable Gate Array (FPGA) IC from AMD that provides reprogrammable digital logic in a compact BGA package. With 1,728 logic elements, approximately 50,000 gates and 176 user I/O pins, it is designed for applications that require moderate logic density, flexible I/O and operation across a wide industrial temperature range.
Key Features
- Core Logic Delivers 1,728 logic elements and approximately 50,000 gates for implementing custom combinational and sequential logic.
- Embedded Memory Includes 32,768 bits of on-chip RAM — approximately 0.033 Mbits of embedded memory for small buffers and state storage.
- I/O Capability Provides 176 user I/O pins to support a variety of external interfaces and parallel connections.
- Power Operates from a core supply voltage range of 2.375 V to 2.625 V, enabling integration into well-defined power domains.
- Package & Mounting Supplied in a 256-ball BGA package (256-FBGA, 17×17) with surface-mount mounting for compact board-level integration.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsh-environment designs.
- Environmental Compliance RoHS-compliant construction supports regulatory requirements for lead-free designs.
Typical Applications
- Embedded Control Implement custom control and glue logic where moderate logic capacity and multiple I/Os are required.
- Industrial Automation Industrial-grade operation and wide temperature range make it suitable for factory-floor controllers, sensor aggregation and actuator interfacing.
- Communications & Interface Bridging Use the device to handle protocol bridging, parallel/serial interfacing and custom timing logic across multiple I/O lines.
- Prototyping and Development Reprogrammable FPGA fabric supports iterative design, proof-of-concept builds and small-scale production runs.
Unique Advantages
- Compact, surface-mount BGA 256-ball FBGA (17×17) package enables high-density board designs while preserving a substantial number of I/Os.
- Balanced logic and I/O capacity 1,728 logic elements paired with 176 I/O pins provide a practical balance for mid-range logic designs.
- Industrial temperature range Rated from −40 °C to 100 °C, supporting designs that require reliable operation in demanding environments.
- Small on-chip RAM Approximately 0.033 Mbits of embedded memory supports local buffering and state storage without external memory.
- RoHS compliance Meets lead-free design requirements for environmentally conscious manufacturing and regulatory conformity.
Why Choose XC2S50-5FG256I?
The XC2S50-5FG256I positions itself as a practical Spartan®-II FPGA option for designers needing moderate programmable logic, a substantial number of I/Os and industrial-grade thermal performance. Its combination of 1,728 logic elements, approximately 50,000 gates and 176 I/O pins supports a wide range of embedded and industrial applications where reprogrammability and board-level density matter.
This device is well suited for development teams and OEMs targeting robust, compact implementations that require on-chip memory, configurable logic and reliable operation across −40 °C to 100 °C. Its surface-mount 256-FBGA package and RoHS-compliant construction help streamline integration into production assemblies.
Request a quote or submit an inquiry to receive pricing and availability for the XC2S50-5FG256I Spartan®-II FPGA.

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