XC2S50-5FG256I

IC FPGA 176 I/O 256FBGA
Part Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 176 32768 1728 256-BGA

Quantity 1,024 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates50000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XC2S50-5FG256I – Spartan®-II Field Programmable Gate Array (FPGA), 1728 logic elements, 256-BGA

The XC2S50-5FG256I is a Spartan®-II Field Programmable Gate Array (FPGA) IC from AMD that provides reprogrammable digital logic in a compact BGA package. With 1,728 logic elements, approximately 50,000 gates and 176 user I/O pins, it is designed for applications that require moderate logic density, flexible I/O and operation across a wide industrial temperature range.

Key Features

  • Core Logic  Delivers 1,728 logic elements and approximately 50,000 gates for implementing custom combinational and sequential logic.
  • Embedded Memory  Includes 32,768 bits of on-chip RAM — approximately 0.033 Mbits of embedded memory for small buffers and state storage.
  • I/O Capability  Provides 176 user I/O pins to support a variety of external interfaces and parallel connections.
  • Power  Operates from a core supply voltage range of 2.375 V to 2.625 V, enabling integration into well-defined power domains.
  • Package & Mounting  Supplied in a 256-ball BGA package (256-FBGA, 17×17) with surface-mount mounting for compact board-level integration.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsh-environment designs.
  • Environmental Compliance  RoHS-compliant construction supports regulatory requirements for lead-free designs.

Typical Applications

  • Embedded Control  Implement custom control and glue logic where moderate logic capacity and multiple I/Os are required.
  • Industrial Automation  Industrial-grade operation and wide temperature range make it suitable for factory-floor controllers, sensor aggregation and actuator interfacing.
  • Communications & Interface Bridging  Use the device to handle protocol bridging, parallel/serial interfacing and custom timing logic across multiple I/O lines.
  • Prototyping and Development  Reprogrammable FPGA fabric supports iterative design, proof-of-concept builds and small-scale production runs.

Unique Advantages

  • Compact, surface-mount BGA  256-ball FBGA (17×17) package enables high-density board designs while preserving a substantial number of I/Os.
  • Balanced logic and I/O capacity  1,728 logic elements paired with 176 I/O pins provide a practical balance for mid-range logic designs.
  • Industrial temperature range  Rated from −40 °C to 100 °C, supporting designs that require reliable operation in demanding environments.
  • Small on-chip RAM  Approximately 0.033 Mbits of embedded memory supports local buffering and state storage without external memory.
  • RoHS compliance  Meets lead-free design requirements for environmentally conscious manufacturing and regulatory conformity.

Why Choose XC2S50-5FG256I?

The XC2S50-5FG256I positions itself as a practical Spartan®-II FPGA option for designers needing moderate programmable logic, a substantial number of I/Os and industrial-grade thermal performance. Its combination of 1,728 logic elements, approximately 50,000 gates and 176 I/O pins supports a wide range of embedded and industrial applications where reprogrammability and board-level density matter.

This device is well suited for development teams and OEMs targeting robust, compact implementations that require on-chip memory, configurable logic and reliable operation across −40 °C to 100 °C. Its surface-mount 256-FBGA package and RoHS-compliant construction help streamline integration into production assemblies.

Request a quote or submit an inquiry to receive pricing and availability for the XC2S50-5FG256I Spartan®-II FPGA.

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