XC2S50-5PQ208I
| Part Description |
Spartan®-II Field Programmable Gate Array (FPGA) IC 140 32768 1728 208-BFQFP |
|---|---|
| Quantity | 582 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 140 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 50000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XC2S50-5PQ208I – Spartan®-II Field Programmable Gate Array (FPGA) IC, 1,728 logic elements, 140 I/O, 208-BFQFP
The XC2S50-5PQ208I is a Spartan®-II field programmable gate array (FPGA) from AMD, delivering a moderate-density, reprogrammable logic solution in a 208-BFQFP package. It integrates 1,728 logic elements and approximately 32,768 bits of on-chip RAM with up to 140 programmable I/O pins, making it suitable for embedded control and custom digital logic implementations.
Designed for surface-mount assembly and industrial operating conditions, the device supports a 2.375 V to 2.625 V core supply and an ambient operating range of -40 °C to 100 °C, enabling deployment in temperature-challenging environments where reliable digital integration is required.
Key Features
- Core Architecture — Spartan®-II FPGA fabric providing 1,728 logic elements and 50,000 equivalent gates for implementing custom combinational and sequential logic functions.
- Embedded Memory — Approximately 32,768 bits of on-chip RAM to support buffering, small lookup tables, and state storage for control logic and data handling.
- I/O Capacity — Up to 140 programmable I/O pins to interface with peripherals, sensors, and external logic devices.
- Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28 mm) optimized for surface-mount PCB assembly.
- Power — Core voltage supply range of 2.375 V to 2.625 V to match system power rail requirements.
- Temperature and Grade — Industrial grade device with an operating temperature range of -40 °C to 100 °C for reliable operation in demanding environments.
- Regulatory — RoHS compliant.
Typical Applications
- Industrial Control — Implement motor control logic, timing, and custom state machines using the device’s logic elements and I/O capacity within industrial temperature ranges.
- Embedded System Glue Logic — Replace multiple discrete components with programmable logic to consolidate interfaces, timing, and protocol conversion using available gates and I/O.
- Custom Digital Prototyping — Rapidly prototype and iterate custom digital designs with on-chip RAM and reprogrammable logic in a surface-mount 208-BFQFP package.
Unique Advantages
- Moderate-density integration: 1,728 logic elements and 50,000 gates provide ample capacity for mid-size digital functions without excessive board area.
- Flexible I/O: Up to 140 programmable I/O pins allow direct interfacing to a wide range of peripherals and external logic devices.
- On-chip RAM: Approximately 32,768 bits of embedded memory support buffering and small data storage needs within the FPGA fabric.
- Industrial temperature range: Rated from -40 °C to 100 °C to support deployment in harsher ambient environments.
- Surface-mount packaging: 208-BFQFP (28×28 PQFP variant) enables reliable SMT assembly for compact board designs.
- RoHS compliant: Meets lead-free manufacturing requirements for environmental compliance.
Why Choose XC2S50-5PQ208I?
The XC2S50-5PQ208I positions itself as a practical, industrial-grade FPGA option for engineers needing a reprogrammable, mid-density logic device with solid I/O and on-chip memory. Its combination of 1,728 logic elements, approximately 32,768 bits of embedded RAM, and 140 I/O in a 208-BFQFP package supports flexible system integration while meeting industrial temperature requirements.
This device is well suited for designers building embedded control systems, custom interface logic, or mid-size prototypes who require a reliable, reprogrammable solution backed by AMD’s Spartan®-II family documentation and support resources.
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