XC2V40-4FGG256C

IC FPGA 88 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 88 73728 256-BGA

Quantity 1,981 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O88Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs64Number of Logic Elements/Cells576
Number of Gates40000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of XC2V40-4FGG256C – Virtex®-II Field Programmable Gate Array (FPGA) IC 88 73728 256-BGA

The XC2V40-4FGG256C is a Virtex®-II platform field programmable gate array supplied in a 256-ball fine-pitch BGA package. This device provides a compact programmable logic solution with on-chip RAM and a moderate I/O count for compact system and board-level designs.

Designed for applications that require configurable logic, embedded memory, and reliable I/O, the XC2V40-4FGG256C combines core logic resources and series-level Virtex-II features to support high-performance interfaces and arithmetic functions while operating within standard commercial temperature and voltage ranges.

Key Features

  • Core Logic  64 configurable logic blocks (CLBs) delivering 576 logic elements to implement custom digital functions and state machines.
  • Embedded Memory  Total on-chip RAM of 73,728 bits for buffering, small data structures, and local storage.
  • I/O and Interface Capability  88 user I/Os provided in a 256-ball FBGA (17×17) package, enabling board-level connectivity and peripheral interfacing.
  • Arithmetic and DSP Support (Platform Feature)  Virtex-II platform documentation includes dedicated 18‑bit × 18‑bit multiplier blocks and fast carry logic chains for arithmetic acceleration.
  • Clock Management (Platform Feature)  Series-level Digital Clock Manager (DCM) functionality for precise clock deskewing and flexible frequency synthesis as described in the Virtex-II documentation.
  • Package and Mounting  256-FBGA (17×17) package in a surface-mount form factor suitable for compact PCB layouts.
  • Power and Operating Range  Core supply range from 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
  • Standards and Compliance  RoHS compliant, supporting environmentally conscious manufacturing and assembly processes.

Typical Applications

  • Memory Interface Logic  Implement SDR/DDR or SRAM interface control and glue logic using the device's logic resources and I/O count.
  • Custom Peripheral Bridging  Bridge and adapt peripherals or sensors to system buses using programmable I/O and on-chip logic.
  • Embedded Control and Sequencing  Implement finite-state machines, control logic, and protocol handling where compact programmable logic is required.
  • Low- to Mid-Complexity DSP Tasks  Leverage platform-level multiplier resources and local RAM for basic signal-processing and arithmetic acceleration.

Unique Advantages

  • Compact, high-density package: The 256-FBGA (17×17) delivers a high pin-count in a space-efficient surface-mount form factor.
  • Balanced logic and memory: 64 CLBs and 73,728 bits of embedded RAM provide a practical mix for control, buffering, and moderate data storage on-chip.
  • Deterministic supply and thermal window: Clearly defined core voltage range (1.425 V–1.575 V) and commercial temperature rating (0 °C–85 °C) simplify power and thermal planning.
  • Series-level architectural features: Benefits from Virtex-II platform capabilities such as DCMs, dedicated multipliers, and SelectIO technology as described in the platform documentation.
  • RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose XC2V40-4FGG256C?

The XC2V40-4FGG256C positions itself as a compact Virtex®-II FPGA option for designs that require reliable programmable logic, a practical amount of embedded RAM, and a moderate number of user I/Os in a 256-FBGA package. Its electrical and thermal specifications make it suitable for commercial electronics where proven platform capabilities—such as dedicated multipliers and clock management—are beneficial.

This device is well suited to engineering teams building board-level interfaces, control logic, and modest DSP or buffering functions who need a proven platform with clearly defined supply and temperature characteristics and RoHS compliance for streamlined manufacturing.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC2V40-4FGG256C. Our team will provide the details needed to evaluate this device for your next design.

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