XC2V40-5FG256I

IC FPGA 88 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 88 73728 256-BGA

Quantity 673 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O88Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs64Number of Logic Elements/Cells576
Number of Gates40000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of XC2V40-5FG256I – Virtex®-II Field Programmable Gate Array (FPGA)

The XC2V40-5FG256I is a Virtex®-II FPGA in a 256-BGA package designed for industrial applications requiring reconfigurable logic and high I/O density. This device integrates 576 logic elements, approximately 73,728 bits of embedded RAM, and 88 user I/O to support control, interfacing, and custom logic functions in compact surface-mount board designs.

Built on the Virtex-II platform, the device leverages the platform’s architecture and IP-rich feature set to address memory interfaces, arithmetic acceleration and configurable I/O requirements for embedded and industrial systems.

Key Features

  • Logic Resources — 576 logic elements suitable for moderate-density logic implementation and custom finite-state machines or glue logic.
  • Embedded Memory — 73,728 bits of on-chip RAM (approximately 0.074 Mbits) for local buffering, small FIFOs or register storage.
  • I/O Capacity — 88 user I/Os supporting a variety of digital interfacing needs within a single 256-BGA footprint.
  • Arithmetic and DSP Support (Platform) — Virtex-II platform documentation describes dedicated 18-bit × 18-bit multiplier blocks for efficient arithmetic acceleration when required by designs.
  • Clock Management (Platform) — The Virtex-II platform includes Digital Clock Manager (DCM) circuitry for flexible clocking and de-skew capabilities as described in platform documentation.
  • Package and Mounting — 256-ball BGA (256-FBGA, 17 × 17) in a surface-mount form factor, balancing connectivity and board-level density.
  • Electrical — Core supply voltage range of 1.425 V to 1.575 V to match system power rails capable of supporting Virtex-II devices.
  • Industrial Temperature Grade — Specified operating range from −40°C to 100°C for deployment in industrial environments.
  • Compliance — RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

  • Industrial Control: Use the FPGA for control logic, sensor aggregation, and protocol bridging where the industrial temperature range and configurable I/O are required.
  • Embedded System Glue Logic: Implement custom bus adapters, timing controllers, and peripheral interfaces using the device’s logic and I/O resources.
  • Memory Interface Prototyping: Leverage platform-level memory interface guidance to develop and validate SDR/DDR and SRAM interface logic for system designs.
  • Signal Processing Acceleration: Apply on-chip RAM and platform multipliers to implement small-scale DSP functions and data buffering in compact designs.

Unique Advantages

  • Industrial-Rated Operation: Rated for −40°C to 100°C operation, enabling use in harsher environments without external qualification steps.
  • Compact, High-Density Package: 256-FBGA (17×17) delivers a balance of I/O count and board-area efficiency for space-constrained designs.
  • Balanced Logic and Memory: 576 logic elements combined with ~73,728 bits of embedded RAM simplify small to medium logic tasks and local buffering needs.
  • Flexible I/O Count: 88 user I/Os provide sufficient connectivity for a range of peripheral interfaces and control signals within one device.
  • Platform-Level Design Support: The Virtex-II platform documentation provides detailed guidance on memory interfaces, clock management, and multiplier resources to accelerate development.
  • RoHS Compliant: Meets current lead-free manufacturing requirements for global production.

Why Choose XC2V40-5FG256I?

The XC2V40-5FG256I offers a practical combination of reconfigurable logic, embedded memory, and I/O density in a 256-BGA package targeted at industrial and embedded designs. Its specified voltage and temperature ranges, together with RoHS compliance and surface-mount packaging, make it suitable for board-level integration where reliability and compact form factor are priorities.

This device is well suited for engineers building compact control systems, custom interface logic, and prototypes that benefit from the Virtex-II platform’s documented features for memory interfacing, arithmetic acceleration, and clock management.

Request a quote or submit a pricing inquiry today to evaluate the XC2V40-5FG256I for your next design and ensure availability for your production schedule.

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