XC2V40-5FGG256I

The XC2V40-5FGG256I is a Virtex®-II field programmable gate array (FPGA) in a 256-ball fine-pitch BGA package designed for industrial-grade embedded designs. It combines programmable logic, embedded RAM, and flexible I/O in a surface-mount 256-FBGA (17×17) package to support applications that require reconfigurable logic, memory interfacing, and moderate gate density.

This device is optimized for designs requiring deterministic operating range and supply requirements, with an operating temperature range of −40 °C to 100 °C and a core supply of 1.425 V to 1.575 V.

Key Features

• Programmable Logic — Includes 64 logic blocks and 576 logic elements (cells) providing roughly 40,000 system gates for custom digital logic implementation.
• Embedded Memory — Provides 73,728 bits of on-chip RAM (approximately 0.074 Mbits) for data buffering, state storage, and small lookup tables.
• I/O Capacity — 88 user I/O pins available in the 256-FBGA package to interface with peripherals and external devices.
• Series-Level Architecture — Part of the Virtex-II platform; supports SelectRAM™ memory hierarchy, 18-bit × 18-bit multiplier blocks, and Digital Clock Manager (DCM) functionality as described in the Virtex-II family specification.
• Package & Mounting — 256-BGA (256-FBGA, 17×17) surface-mount package suitable for compact board designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Power Supply — Core voltage specified between 1.425 V and 1.575 V to match system rail design constraints.
• Compliance — RoHS compliant.

Typical Applications

• Memory Interface Controllers — Used where embedded logic must interface with external DRAM/SRAM devices, leveraging the Virtex-II platform’s memory interface capabilities.
• Custom DSP and Arithmetic Acceleration — Suitable for designs that use the family’s 18-bit × 18-bit multiplier resources for arithmetic operations and signal processing tasks.
• Embedded Control and Glue Logic — Implement protocol bridging, peripheral control, and glue logic for industrial systems requiring reconfigurable hardware.
• Small-Scale Prototyping and Development — A practical FPGA option for proof-of-concept implementations where moderate logic capacity and on-chip RAM suffice.

Unique Advantages

• Compact, high-density package: The 256-FBGA (17×17) package provides a compact footprint with 88 available I/Os for space-constrained designs.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in demanding environments.
• Embedded memory resources: On-chip SelectRAM-style memory (73,728 bits) enables local buffering and state storage without external RAM.
• Targeted logic capacity: Approximately 40,000 gates with 576 logic cells supports moderate-complexity custom logic implementations.
• Series-level feature set: Access to Virtex-II platform capabilities such as 18×18 multipliers and clock management features simplifies common DSP and timing tasks.
• RoHS compliant: Meets environmental directives for lead-free assembly and manufacturing processes.

Why Choose XC2V40-5FGG256I?

The XC2V40-5FGG256I offers a focused combination of configurable logic, embedded RAM, and discrete I/O in a compact industrial-grade 256-FBGA package. Its supply and temperature specifications make it suitable for embedded systems that require deterministic operating conditions and moderate gate density.

This device is well suited to engineers and procurement teams building memory interfaces, control logic, and arithmetic-accelerated functions who need a proven Virtex-II platform FPGA with on-chip memory and multiplier resources backed by comprehensive family-level documentation.

Request a quote or submit a purchase inquiry for the XC2V40-5FGG256I to receive pricing and availability information tailored to your design needs.