XC2V4000-4BF957I

The XC2V4000-4BF957I is a Virtex®-II field programmable gate array in a 957-ball flip-chip BGA (40 × 40) package. It delivers high-density programmable logic with 51,840 logic elements and approximately 2.21 Mbits of embedded RAM, making it suitable for designs that require substantial on-chip logic and memory integration. Targeted for industrial-grade applications, this device supports a 1.425 V–1.575 V core supply and operates from -40 °C to 100 °C.

Key Features

• Core Logic  51,840 logic elements (equivalent density for complex logic implementations), supporting designs up to approximately 4,000,000 system gates.
• Embedded Memory  Approximately 2.21 Mbits of on-chip RAM (total RAM bits: 2,211,840) for distributed and block memory needs.
• High I/O Density  684 user I/Os to support broad interfacing needs; SelectIO series technology in the Virtex®-II family provides flexible signaling standards and high-speed I/O options.
• Arithmetic and DSP Support  Series-level Virtex®-II architecture includes dedicated 18-bit × 18-bit multiplier resources and fast carry logic to accelerate arithmetic and signal-processing functions.
• Clock Management  Virtex®-II platform features Digital Clock Manager (DCM) and global clock buffering capabilities for precise clock control and low-skew clock distribution.
• Package & Mounting  957-ball flip-chip BGA (957-FCBGA, 40 × 40) package; surface-mount device designed for board-level integration.
• Power & Thermal  Core voltage range: 1.425 V to 1.575 V. Industrial operating temperature range: -40 °C to 100 °C.
• Standards & Compliance  RoHS compliant and supplied in an industrial-grade variant.
• Toolchain Support  Virtex®-II devices are supported by the Xilinx Foundation and Alliance Series development systems for HDL-based design workflows and system integration.

Typical Applications

• Memory interface controllers  Implement SDR/DDR and other DRAM/SRAM controllers using the device’s high logic density and on-chip RAM.
• High-speed I/O and communications  Use the abundant I/O and high-speed signaling capabilities for protocol bridging, link aggregation, and data-path interfacing.
• Signal processing and DSP  Leverage dedicated multiplier blocks and extensive logic resources for filtering, transforms, and real-time processing tasks.
• System prototyping and integration  Combine large logic capacity and embedded memory to prototype complex SoC functions or to integrate multiple functions on a single FPGA.

Unique Advantages

• High integration density: 51,840 logic elements and roughly 2.21 Mbits of embedded RAM reduce external component count and simplify board design.
• Broad interfacing capability: 684 I/Os and Virtex®-II SelectIO options enable flexible signaling standards and high-speed connections to peripherals and memory.
• Deterministic clocking: On-chip clock management features deliver precise phase/frequency control for multi-domain designs.
• Industrial robustness: Specified for -40 °C to 100 °C operation and supplied in an industrial-grade package for demanding environments.
• Established development ecosystem: Supported by Xilinx development systems, facilitating HDL design flows and integration into existing toolchains.
• Regulatory friendliness: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose XC2V4000-4BF957I?

The XC2V4000-4BF957I provides a balance of high logic capacity, substantive embedded memory, and a large I/O complement in a reliable industrial-grade FCBGA package. It is well suited for engineers who need to consolidate complex logic, memory controllers, and high-speed interfaces into a single programmable device. Combined with Virtex®-II platform features for clock management and DSP acceleration and supported by Xilinx development tools, this part offers a practical option for mid-to-high complexity FPGA designs where integration and predictable operation across industrial temperatures matter.

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