XC2V4000-4FF1152I

IC FPGA 824 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 824 2211840 1152-BBGA, FCBGA

Quantity 1,227 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O824Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5760Number of Logic Elements/Cells51840
Number of Gates4000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2211840

Overview of XC2V4000-4FF1152I – Virtex®-II FPGA, 4,000,000 gates, 1152-FCBGA

The XC2V4000-4FF1152I is a Virtex®-II field programmable gate array offered in a 1152-ball flip-chip BGA (FCBGA) package. It delivers high logic density and extensive I/O capacity for industrial-grade applications that require on-chip memory, DSP resources, and flexible interfacing.

Built on the Virtex‑II platform architecture, this device targets designs needing large gate counts, substantial embedded RAM, and a broad set of I/O capabilities while operating across an industrial temperature range.

Key Features

  • Logic Density  Up to 4,000,000 system gates with 51,840 logic elements, enabling complex, high-density designs on a single device.
  • Embedded Memory  Total on-chip RAM of 2,211,840 bits (approximately 2.2 Mbits) for data buffering, FIFOs, and small memory structures integrated into the fabric.
  • I/O Capability  824 user I/Os provide extensive external interfacing. Family I/O features include support for multiple single-ended and differential standards and on-chip termination options.
  • Arithmetic and DSP  Dedicated 18-bit × 18-bit multiplier blocks provide hardware multiply resources for signal processing and arithmetic acceleration.
  • Clock Management  Supports Digital Clock Manager (DCM) functionality and global clock multiplexer buffers for precise clocking, de-skew, and frequency synthesis (Virtex‑II family features).
  • Routing and Architecture  Active interconnect and a segmented routing structure for predictable routing delay and scalable performance across large designs (Virtex‑II family architecture).
  • Package and Thermal  1152-FCBGA (35×35) flip‑chip BGA, surface-mount package. Voltage supply 1.425 V to 1.575 V; operating temperature range −40 °C to 100 °C.
  • Compliance  RoHS-compliant manufacturing.

Typical Applications

  • High‑performance data acquisition  Use the device’s large logic capacity and embedded memory to implement real-time data capture, pre-processing, and buffering functions.
  • Communications and networking  Leverage abundant I/O and on-chip multipliers for packet processing, protocol bridging, and custom interface logic.
  • Memory interface controllers  Implement SDR/DDR and other external memory interfaces using the FPGA’s selectable I/O standards and embedded memory resources.
  • Signal processing accelerators  Deploy dedicated multiplier blocks and distributed RAM for DSP blocks, filters, and arithmetic-intensive pipelines.

Unique Advantages

  • High on-chip integration: Consolidate complex systems with 4,000,000 gates and 51,840 logic elements to reduce board-level BOM and inter-device latency.
  • Substantial embedded memory: Approximately 2.2 Mbits of on-chip RAM supports buffering and state storage without external memory for many use cases.
  • Extensive I/O flexibility: 824 user I/Os and family SelectIO features enable a wide range of signaling standards and termination options for diverse peripheral and high-speed links.
  • DSP-ready resources: Dedicated 18×18 multipliers accelerate arithmetic workloads, easing implementation of filters, transforms, and other DSP functions.
  • Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
  • Development ecosystem: Supported by the Virtex‑II development ecosystem, including Xilinx Foundation and Alliance Series development systems for HDL design and compilation.

Why Choose XC2V4000-4FF1152I?

The XC2V4000-4FF1152I positions itself as a high-density, industrial-grade FPGA for applications that demand large logic capacity, significant embedded memory, and broad I/O connectivity. Its mix of logic elements, on-chip RAM, dedicated multipliers, and clock management features makes it well suited for complex signal processing, memory interfacing, and communications tasks.

This device is ideal for engineering teams building scalable, integration‑focused solutions who need proven Virtex‑II platform capabilities and access to established FPGA design tools and flows. The combination of package options, operating range, and RoHS compliance supports long-term deployment in industrial systems.

Request a quote or submit a quote to receive pricing and availability for the XC2V4000-4FF1152I and to discuss your design requirements.

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