XC2V40-6FGG256C

The XC2V40-6FGG256C is a Virtex®-II field programmable gate array presented in a compact 256-ball BGA package. It integrates 64 configurable logic blocks (CLBs) delivering 576 logic elements, approximately 73,728 bits of embedded RAM, and 88 general-purpose I/O pins, providing a balanced resource set for commercial embedded and I/O-centric designs.

Designed for surface-mount assembly and RoHS compliance, this device operates from a core supply of 1.425 V to 1.575 V and is specified for commercial temperature operation from 0 °C to 85 °C—making it suitable for a wide range of commercial applications that need moderate logic capacity with on-chip memory and flexible I/O.

Key Features

• Core Logic 64 CLBs offering a total of 576 logic elements to implement custom digital functions and control logic.
• Embedded Memory Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, FIFOs, and small data structures.
• I/O Count 88 user I/O pins for interfacing with external peripherals, sensors, and memory components.
• Package 256-ball fine-pitch BGA (supplier package: 256-FBGA, 17 × 17) optimized for compact PCB layouts and high-density routing.
• Power Core supply voltage range of 1.425 V to 1.575 V for stable logic operation within specified supply tolerances.
• Thermal & Mounting Surface-mount package rated for commercial operating temperatures from 0 °C to 85 °C.
• Design Grade & Compliance Commercial-grade device with RoHS compliance for environmentally conscious designs.
• Logic Scale Approximately 40,000 gates to support glue logic, protocol bridging, and moderate combinational/sequential designs.

Typical Applications

• Embedded System Control — Implements custom control logic, protocol handling, and peripheral management in commercial embedded products.
• Interface Bridging — Acts as a glue-logic or protocol converter between disparate digital interfaces using its 88 I/O pins and on-chip memory for buffering.
• Prototyping and Evaluation — Suitable for development boards and evaluation platforms where a mid-density FPGA is needed to validate hardware concepts.
• Consumer and Commercial Electronics — Enables feature integration and custom logic in consumer devices and commercial instrumentation within the specified temperature and grade limits.

Unique Advantages

• Balanced resource mix: Combines 576 logic elements with embedded RAM (≈0.074 Mbits) to support both control logic and small buffering tasks without external memory.
• Compact BGA footprint: 256-ball (17 × 17) package minimizes PCB area while maintaining ample I/O for peripheral connections.
• Commercial-grade reliability: Specified operating range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
• Predictable power requirements: Tight core voltage range (1.425 V–1.575 V) simplifies power-supply design and decoupling strategies.
• Surface-mount convenience: Standard surface-mount package simplifies automated assembly and reflow manufacturing processes.

Why Choose XC2V40-6FGG256C?

The XC2V40-6FGG256C offers a pragmatic combination of logic capacity, embedded memory, and I/O density in a space-efficient 256-BGA package—well suited for commercial embedded designs that require custom digital logic and moderate buffering on-chip. Its defined supply and temperature ratings, together with RoHS compliance, make it a reliable choice for production-ready applications where a mid-density FPGA is appropriate.

Engineers selecting this part benefit from a straightforward device profile: ample I/O, a clear power envelope, and on-chip RAM to reduce external component count—helping accelerate time-to-market for commercial products and prototypes alike.

Request a quote or submit an RFQ today to get pricing, availability, and lead-time information for the XC2V40-6FGG256C and to discuss how it fits your next commercial FPGA design.