XC2V4000-4FFG1152I

The XC2V4000-4FFG1152I is a Virtex®-II series Field Programmable Gate Array (FPGA) in a 1152-FCBGA package, intended for industrial applications. It delivers a high-density programmable fabric with 51,840 logic cells, approximately 2.21 Mbits of embedded RAM, and 824 user I/Os to support complex system integration and high-performance interfacing.

Designed for system designs that require abundant logic resources, extensive on-chip memory, and flexible I/O, this device supports a range of memory interfaces, arithmetic blocks and clock-management features found across the Virtex-II platform.

Key Features

• Logic Capacity — 51,840 logic elements (cells) providing substantial programmable logic for complex designs and implementation of wide datapaths or parallel processing blocks.
• Embedded Memory — Approximately 2.21 Mbits of total on-chip RAM for buffering, FIFOs, and local storage without external memory dependence.
• High I/O Count — 824 user I/Os to support extensive peripheral and memory interfaces, enabling dense board-level connectivity.
• Gate Equivalent — Approximately 4,000,000 system gates for mapping moderate-to-high complexity functions in a single device.
• Arithmetic Resources — Series-level Virtex-II features include dedicated 18×18 multipliers for efficient DSP and arithmetic-intensive operations.
• Clock Management — Platform-level digital clock manager (DCM) and global clock resources support precise clocking and frequency control for synchronous designs.
• Package & Mounting — 1152-ball Flip-Chip BGA (1152-FCBGA, 35×35) in a surface-mount form factor for compact, high-density PCB implementations.
• Power & Operating Range — Core supply range 1.425 V to 1.575 V; industrial operating temperature range from −40 °C to 100 °C.
• Compliance — RoHS compliant, supporting lead-free assembly and regulatory requirements.

Typical Applications

• Memory Interface Controllers — Implement DDR/SDR memory controllers and custom DRAM/SRAM interfaces using the device's high I/O count and on-chip memory.
• Signal Processing and DSP — Use embedded RAM and dedicated multipliers for buffering and arithmetic acceleration in communications, imaging, and sensor processing.
• High-Density I/O Systems — Aggregate many peripheral connections or build wide parallel buses leveraging the 824 user I/Os for data acquisition and control systems.

Unique Advantages

• Substantial Logic and Memory in One Device: 51,840 logic elements combined with ~2.21 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
• Broad I/O Flexibility: 824 I/Os enable direct interfacing to a wide range of peripherals and memory devices, minimizing external glue logic.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet demanding environmental requirements for industrial deployments.
• Compact Ball-Grid Packaging: 1152-FCBGA packaging allows high I/O density in a compact footprint for space-constrained boards.
• Verified Platform Capabilities: Virtex-II platform-level features such as SelectRAM memory hierarchy, 18×18 multipliers and clock management provide a known set of resources for predictable design mapping.

Why Choose XC2V4000-4FFG1152I?

The XC2V4000-4FFG1152I positions itself as a versatile Virtex®-II FPGA combining significant logic density, substantial embedded memory, and a large I/O complement in a surface-mount 1152-FCBGA package. Its industrial-grade temperature range and RoHS compliance make it suitable for robust, long-life systems that require on-chip memory and high I/O integration.

This device is well suited for engineers building memory-rich controllers, DSP-accelerated subsystems, and complex I/O aggregation solutions who need a balance of programmable logic, embedded RAM, and I/O bandwidth within a single FPGA footprint.

Request a quote or submit an inquiry to receive pricing and availability for the XC2V4000-4FFG1152I and to discuss how it can fit into your next design.