XC2V4000-5FF1152I

The XC2V4000-5FF1152I is an industrial-grade Virtex®-II FPGA IC from AMD, built on the Virtex-II platform architecture. It combines a high logic capacity and on-chip memory with a large I/O count and a flip-chip 1152-FCBGA package to support dense, high‑performance programmable designs.

This device is suitable for designs that require substantial configurable logic, embedded RAM, and broad I/O bandwidth while operating across an industrial temperature range. Its architecture and feature set are drawn from the Virtex-II family specification.

Key Features

• Logic Capacity  Approximately 51,840 logic elements, providing extensive resources for complex logic implementation.
• Configurable Logic Blocks  Virtex-II architecture with a large complement of CLB-based resources (series-level features included in the Virtex-II data sheet).
• Embedded Memory  Approximately 2.21 Mbits of on-chip RAM (2,211,840 bits) to support data buffering, FIFOs, and local storage.
• High I/O Count  824 device I/Os to enable wide parallel interfaces and multiple high-density external connections.
• Arithmetic Resources  Series-level Virtex-II architecture includes dedicated multiplier blocks for efficient arithmetic and DSP tasks (per Virtex-II data sheet).
• Clock and Timing Management  Virtex-II family features such as Digital Clock Manager (DCM) and global clock multiplexer buffers are part of the platform specification.
• Package  1152-FCBGA (35 × 35 mm) flip-chip BGA package for surface-mount assembly and dense board integration; package case listed as 1152‑BBGA, FCBGA.
• Power  Voltage supply range: 1.425 V to 1.575 V to match system power domains requiring this core voltage window.
• Operating Temperature  Rated for industrial operation from −40 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density digital systems  Implement complex control logic, data processing pipelines, and glue‑logic where large logic capacity and many I/Os are required.
• Memory interface and buffering  Use the device’s embedded RAM and Virtex‑II memory hierarchy for DRAM/SRAM interface logic and local buffering functions.
• Signal processing and arithmetic  Leverage the series-level dedicated multiplier resources and abundant logic elements for DSP blocks, fixed-point arithmetic, and custom accelerators.

Unique Advantages

• Substantial logic resources: Approximately 51,840 logic elements enable large FPGA designs and complex state machines without immediate migration to larger devices.
• Significant embedded memory: Approximately 2.21 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage needs.
• High I/O density: 824 device I/Os provide flexibility for wide data buses, multi-channel interfaces, and parallel connectivity.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsher environments and industrial equipment.
• Dense package integration: 1152‑pin FCBGA (35×35) offers a compact footprint for high‑pin‑count designs in space-constrained PCBs.
• RoHS compliance: Meets common environmental compliance requirements for lead‑free assembly.

Why Choose XC2V4000-5FF1152I?

The XC2V4000-5FF1152I pairs the Virtex®-II platform’s series-level capabilities—extensive logic resources, embedded RAM, arithmetic building blocks and clock management features—with a high I/O count and an industrial operating range. This combination makes it well suited for engineers designing dense, performance-oriented FPGA systems that must run reliably across wide temperatures.

Its flip-chip 1152‑FCBGA package and RoHS compliance support modern surface-mount assembly and environmentally conscious manufacturing. Select this device when you need a field‑programmable solution that balances logic capacity, on-chip memory, and I/O bandwidth within the Virtex‑II family specification.

Request a quote or submit a procurement inquiry to move forward with pricing, availability, and lead-time details for the XC2V4000-5FF1152I.