XC2V4000-6FFG1152C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 824 2211840 1152-BBGA, FCBGA |
|---|---|
| Quantity | 691 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 824 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5760 | Number of Logic Elements/Cells | 51840 | ||
| Number of Gates | 4000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2211840 |
Overview of XC2V4000-6FFG1152C – Virtex®-II Field Programmable Gate Array (FPGA), 1152-FCBGA
The XC2V4000-6FFG1152C is a commercial-grade Virtex®-II FPGA offering high-density programmable logic, on-chip memory and flexible I/O in a 1152-ball flip-chip BGA package. It is intended for designs that require up to 4,000,000 system gates, substantial embedded RAM and a large number of user I/Os.
Built on the Virtex-II platform architecture, this device combines a dense logic fabric with block RAM, dedicated multipliers and advanced I/O capabilities to address applications that need programmable logic, memory interfaces and high I/O counts within a surface-mount 1152-FCBGA footprint.
Key Features
- Core Density 4,000,000 system gates with 51,840 logic elements to implement complex custom logic and control functions.
- Embedded Memory Approximately 2.2 Mbits of on-chip RAM (2,211,840 total RAM bits) for data buffering, FIFOs and embedded storage.
- I/O Capacity 824 user I/O pins to support wide external interfaces and parallel buses in a single device.
- Arithmetic & DSP Dedicated 18-bit × 18-bit multiplier blocks (Virtex-II series feature) for arithmetic acceleration and DSP workloads.
- Clock Management Digital Clock Manager (DCM) capabilities (Virtex-II series feature) for flexible clocking, de-skew and phase adjustment in complex designs.
- Advanced I/O Technologies SelectIO™-class I/O features in the Virtex-II family, including support for high-speed differential and single-ended standards (series-level capabilities).
- Package & Mounting 1152-ball FCBGA (1152-FCBGA, 35 × 35) surface-mount package for high-density board integration.
- Power & Supply Core supply range: 1.425 V to 1.575 V, enabling defined power budgeting and supply design.
- Operating Range & Compliance Commercial operating temperature range of 0 °C to 85 °C and RoHS-compliant lead-free status.
Typical Applications
- Memory Interface Bridges Use the device’s abundant logic and embedded RAM to implement SDR/DDR and other memory interfacing and controller functions.
- High-Speed I/O Systems With 824 user I/Os and Virtex-II SelectIO-class features, the device is suited for wide parallel interfaces, protocol bridging and high-density connectivity.
- DSP & Arithmetic Acceleration Dedicated 18×18 multiplier blocks and on-chip RAM make the device appropriate for fixed-point DSP tasks and hardware-accelerated arithmetic pipelines.
- Custom Embedded Logic Large logic capacity and on-chip memory enable complex control logic, state machines and embedded system glue logic in compact board designs.
Unique Advantages
- High integration density: 4,000,000 gates and 51,840 logic elements provide significant logic capacity in a single FPGA package, reducing the need for multiple devices.
- Substantial on-chip memory: Approximately 2.2 Mbits of embedded RAM supports local buffering and reduces external memory dependency for many designs.
- Large I/O count: 824 user I/Os allow broad connectivity and simplify PCB routing for multi-channel or wide-bus applications.
- Designed for surface-mount deployment: 1152-FCBGA (35 × 35) packaging supports high-density PCB assembly and compact system integration.
- Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operating range and RoHS status suitable for mainstream electronic products.
Why Choose XC2V4000-6FFG1152C?
The XC2V4000-6FFG1152C positions itself as a high-density, commercially graded Virtex-II FPGA suited to designs that demand multi-million gate capacity, significant embedded memory and a large number of I/Os in a single surface-mount package. Its combination of logic resources, on-chip RAM and arithmetic building blocks makes it appropriate for applications that require integrated logic and memory functions without partitioning across multiple devices.
For engineers and procurement teams looking for a programmable platform with defined voltage and temperature limits, RoHS compliance and a 1152-FCBGA package, this device offers a clear specification set to guide system design, power budgeting and thermal planning.
Request a quote or submit a product inquiry to get pricing, availability and lead-time information for the XC2V4000-6FFG1152C.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








