XC2V500-4FG456I

The XC2V500-4FG456I is a Virtex®-II FPGA in a 456-ball BGA package designed for industrial applications. It delivers programmable logic, embedded memory, and high-density I/O in a surface-mount 456-FBGA (23×23) footprint.

Built on the Virtex-II platform, this device targets designs that require flexible logic resources, embedded RAM, and extensive I/O while operating across a wide industrial temperature range and a defined core voltage window.

Key Features

• Logic Capacity  6,912 logic elements providing programmable combinational and sequential resources suitable for medium-density FPGA designs.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for data buffering, state storage, and on-chip memory structures.
• Gate Equivalent  Approximately 500,000 gates of logic capacity to support complex control, glue-logic, and data-path implementations.
• I/O Density  264 user I/Os to support broad peripheral, memory, and high-speed interface connectivity.
• DSP and Arithmetic Blocks  Series Virtex-II features include dedicated 18-bit × 18-bit multiplier blocks for hardware-accelerated arithmetic (refer to series datasheet for full DSP resources).
• Clock Management  Virtex-II platform clock-management features such as Digital Clock Manager (DCM) modules and global clock multiplexers are available at the series level to simplify timing control (see datasheet).
• Power and Supply  Core supply operation specified from 1.425 V to 1.575 V to match system power rails.
• Package & Mounting  456-ball BGA in a 23×23 FBGA format, surface-mount assembly for compact board-level integration.
• Operating Range  Industrial temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant for regulatory and environmental alignment.

Typical Applications

• Memory Interface and Buffering  Use where on-chip RAM and plentiful I/O are needed to implement SDR/DDR or SRAM interface controllers and buffering logic.
• Embedded Control and Glue Logic  Ideal for complex control functions, protocol bridging, and board-level glue where programmable logic and moderate gate density are required.
• Signal Processing Acceleration  Leverage dedicated multiplier resources (series feature) and on-chip RAM for fixed-point DSP tasks and arithmetic offload.
• High-Density I/O Integration  Suitable for designs needing many parallel or multiplexed I/Os in a compact BGA package, such as interface hubs and communication endpoints.

Unique Advantages

• Balanced Logic and Memory  6,912 logic elements combined with approximately 0.59 Mbits of embedded RAM offers a practical balance for mid-range FPGA designs without excessive external memory.
• Robust I/O Count  264 I/Os allow integration of multiple peripherals, buses, and memory interfaces directly to the FPGA fabric, reducing external glue components.
• Industrial Temperature Rating  Specified operation from −40 °C to 100 °C supports deployments in industrial and temperature-challenging environments.
• Defined Core Power Envelope  A documented core voltage range (1.425 V–1.575 V) simplifies power supply design and helps guarantee correct device operation.
• Compact Surface-Mount Package  456-FBGA (23×23) package provides high I/O density in a compact, board-friendly form factor.

Why Choose XC2V500-4FG456I?

The XC2V500-4FG456I positions itself as a mid-density Virtex-II FPGA offering a blend of logic, embedded memory, and substantial I/O in an industrial-grade package. It is suitable for engineers who need a programmable platform with defined power and thermal specifications for industrial applications.

Its combination of approximately 6,912 logic elements, 589,824 bits of on-chip RAM, and 264 I/Os provides designers with the flexibility to implement control logic, memory interfaces, and signal processing blocks while keeping board complexity manageable.

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