XC2V500-4FGG256I

The XC2V500-4FGG256I is a Virtex‑II Field Programmable Gate Array (FPGA) supplied in a 256‑ball BGA package intended for surface-mount assembly. This industrial-grade device delivers a mid-range balance of logic capacity, embedded memory and I/O count for programmable digital designs.

With approximately 6,912 logic elements, roughly 0.59 Mbits of on‑chip RAM and 172 user I/Os, the XC2V500-4FGG256I is suited for applications that require substantial logic integration, embedded memory and a high pin count within a compact 256‑FBGA (17×17) footprint. The device is RoHS compliant and supports a 1.425 V to 1.575 V supply range with an operating temperature from ‑40 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 6,912 logic elements and 500,000 system gates provide mid-range programmable logic resources for complex combinational and sequential designs.
• Embedded Memory  Approximately 0.59 Mbits of on‑chip RAM (589,824 total bits) for implementing buffers, FIFOs and small data stores without external memory.
• I/O Resources  172 user I/Os support extensive external interfacing and board-level connectivity in a single device.
• Package & Mounting  256‑BGA package (supplier device package: 256‑FBGA, 17×17) for high‑density board integration; surface mount mounting type.
• Power  Specified core supply range of 1.425 V to 1.575 V to match typical Virtex‑II core voltage requirements.
• Temperature & Grade  Industrial grade device specified for operation from ‑40 °C to 100 °C.
• Standards & Compliance  RoHS compliant.
• Virtex‑II Series Architecture  Series-level features described in the Virtex‑II platform include SelectRAM block memory architecture, dedicated 18‑bit × 18‑bit multiplier blocks, Digital Clock Manager (DCM) resources and SelectIO I/O technologies for a wide range of signaling standards.

Typical Applications

• Embedded signal processing  Use on‑chip logic and embedded RAM to implement intermediate signal processing, buffering and control functions without immediate external memory.
• Interface consolidation  172 I/Os enable aggregation of multiple peripheral interfaces and board-level signal routing into a single programmable device.
• Industrial control and automation  Industrial temperature rating and robust logic capacity make this device suitable for programmable control, sequencing and data aggregation tasks in industrial systems.

Unique Advantages

• Balanced mid‑range integration:  Combines several thousand logic elements with substantial embedded RAM and a high I/O count to reduce external component count and simplify board design.
• Industrial temperature range:  Rated for ‑40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact, high‑density package:  256‑FBGA (17×17) package enables a compact PCB footprint while providing many user I/Os.
• Series-proven architecture:  Built on the Virtex‑II platform architecture that includes SelectRAM, dedicated multiplier blocks and clock management features suited for complex timing and arithmetic tasks.
• RoHS compliant:  Meets regulatory requirements for lead‑free assembly and environmental compliance.

Why Choose XC2V500-4FGG256I?

The XC2V500-4FGG256I positions itself as a capable, industrial‑grade Virtex‑II FPGA offering a practical mix of logic density, embedded memory and I/O count in a compact 256‑BGA package. Its specified operating range and RoHS compliance make it suitable for long‑lasting embedded and industrial designs where on‑chip resources can reduce system complexity and BOM.

Designers seeking mid‑range programmable logic with meaningful on‑chip RAM, dedicated arithmetic resources and extensive I/O in a surface‑mount BGA footprint will find the XC2V500-4FGG256I a compelling option for consolidating functions and accelerating development on the Virtex‑II platform.

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