XC2V500-5FG256I

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 589824 256-BGA

Quantity 1,111 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6912
Number of Gates500000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC2V500-5FG256I – Virtex®-II Field Programmable Gate Array, 172 I/O, 256-BGA

The XC2V500-5FG256I is a Virtex®-II platform FPGA supplied in a 256-ball fine-pitch BGA (17 × 17 mm FBGA) package. Designed for industrial-temperature deployments, this device integrates configurable logic, embedded memory, and high-performance I/O in a surface-mount form factor.

Targeted at designs that require flexible logic resources, on-chip RAM, and robust clocking and arithmetic support, the device is suitable for applications demanding reconfigurable hardware with precision timing and multiple I/O interfaces. It ships RoHS compliant and operates across an extended voltage and temperature range to support industrial systems.

Key Features

  • Logic Resources — 768 CLBs (configurable logic blocks) providing 6,912 logic elements/cells and approximately 500,000 gates for implementing custom digital logic.
  • Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM to support buffering, lookup tables, and state storage within logic designs.
  • Dedicated Arithmetic Blocks — Series-level Virtex®-II architecture includes dedicated multiplier resources for high-throughput arithmetic (as described in the Virtex-II product specification).
  • High-Performance I/O — 172 user I/O pins (package-limited) supporting high-speed interfaces and diverse signaling standards described in the Virtex®-II platform documentation.
  • Clock Management — Device family features Digital Clock Manager (DCM) and global clock routing options for precise clock de-skew and flexible frequency management (per Virtex®-II platform specification).
  • Package and Mounting — 256-BGA (256-FBGA, 17×17 mm) package optimized for surface-mount assembly and compact system integration.
  • Electrical and Environmental — Supply voltage 1.425 V to 1.575 V, industrial operating temperature range −40 °C to 100 °C, and RoHS compliant.

Typical Applications

  • Memory Interface and Bridging — Implement SDR/DDR memory controllers and interface logic using the device’s on-chip RAM and high-performance I/O.
  • Signal Processing and DSP — Use dedicated multiplier blocks and the available logic fabric for filtering, transform engines, and real-time arithmetic workloads.
  • Prototyping and Custom Logic — Rapidly implement and iterate custom digital functions, state machines, and control logic with abundant logic elements and embedded memory.
  • High-Speed I/O Integration — Aggregate and route multiple high-bandwidth serial or parallel interfaces using the device’s extensive I/O resources and platform clocking features.

Unique Advantages

  • Configurable, Deterministic Logic: 768 CLBs and 6,912 logic elements/cells provide a predictable resource set for complex finite-state machines and data-path implementations.
  • On-Chip Memory for Low-Latency Tasks: Approximately 0.59 Mbits of embedded RAM reduces external memory dependence for buffering and tight-loop processing.
  • Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in industrial environments without derating logic or I/O capability.
  • Compact Surface-Mount Package: 256-FBGA (17×17 mm) enables high-density board layouts while maintaining 172 user I/Os for system connectivity.
  • Controlled Supply Range: Narrow supply window (1.425 V–1.575 V) helps designers manage power rails and ensure stable core operation in system designs.
  • Regulatory and Supply Confidence: RoHS compliance supports environmentally conscious manufacturing and downstream regulatory requirements.

Why Choose XC2V500-5FG256I?

The XC2V500-5FG256I brings together a Virtex®-II FPGA architecture with a balanced set of logic, embedded memory, and I/O resources in a compact 256-FBGA package. Its industrial-grade temperature range and controlled core voltage make it a practical choice for embedded system designers who need reprogrammable hardware with reliable environmental performance.

This device suits teams building memory interfaces, DSP blocks, custom control logic, or multi-interface bridging where predictable logic resources and on-chip RAM simplify board-level design and reduce external component count. Backed by the Virtex®-II family documentation and platform features, it offers a stable foundation for mid-density FPGA applications.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the XC2V500-5FG256I. Our team can provide lead-time details and assistance with part selection for your design requirements.

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