XC2V500-4FGG456C

IC FPGA 264 I/O 456FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 264 589824 456-BBGA

Quantity 768 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O264Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6912
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC2V500-4FGG456C – Virtex®-II FPGA, 456-BBGA, 264 I/O

The XC2V500-4FGG456C is a Virtex®-II field programmable gate array (FPGA) in a 456-ball BGA package designed for commercial-grade applications. The device integrates a substantial logic fabric, embedded RAM, and a high I/O count to support complex digital functions such as memory interfaces, signal processing, and custom logic implementation.

Built on the Virtex-II platform architecture, this FPGA combines configurable logic blocks, dedicated multiplier resources, and flexible I/O to address designs that require on-chip processing, external memory interfacing, and moderate-speed programmable logic.

Key Features

  • Configurable Logic — 768 configurable logic blocks (CLBs) providing 6,912 logic cells, enabling substantial combinational and sequential logic implementation.
  • On‑Chip Memory — Approximately 0.59 Mbits of embedded RAM (589,824 total RAM bits) for FIFOs, buffers, and local data storage.
  • Arithmetic Resources — Dedicated 18-bit × 18-bit multiplier blocks (Virtex‑II series feature) for efficient hardware multiplication and DSP tasks.
  • I/O Capacity — 264 user I/Os to support broad peripheral connectivity and parallel interfaces.
  • Logic Density — Device-level equivalent of 500,000 gates for mapping complex logic and state machines.
  • Package and Mounting — 456-ball fine-pitch BGA (456-BBGA, supplier package 456-FBGA 23×23) with surface-mount mounting type for compact board integration.
  • Power and Supply — Core supply voltage range of 1.425 V to 1.575 V for stable VccINT operation.
  • Operating Conditions — Commercial grade with operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.

Typical Applications

  • Memory Interfaces and Controllers — Use the device’s embedded RAM and high-speed I/O capability to build SDR/DDR and SRAM interface logic and custom memory controllers.
  • Digital Signal Processing — Leverage dedicated 18×18 multipliers and on-chip RAM for filters, transforms, and other real-time DSP blocks.
  • Custom Protocol and Bridge Logic — Implement protocol conversion, bus bridging, and glue logic using abundant logic cells and 264 I/O pins for external connectivity.

Unique Advantages

  • Balanced Logic and Memory: The combination of 6,912 logic cells and approximately 0.59 Mbits of embedded RAM supports mixed control and data-path functions on a single device.
  • Dedicated DSP Support: 18×18 multipliers provide hardware-accelerated arithmetic, reducing the need for external DSP components.
  • High I/O Count: 264 user I/Os enable wide parallel interfaces and flexible board-level integration without multiplexing compromises.
  • Compact BGA Package: 456-ball FBGA (23×23) minimizes PCB area while preserving high pin count for dense designs.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for typical commercial product requirements.

Why Choose XC2V500-4FGG456C?

The XC2V500-4FGG456C positions itself as a practical Virtex‑II platform FPGA for designs that need a solid balance of logic density, embedded memory, DSP capabilities, and broad I/O. Its combination of 768 CLBs (6,912 logic cells), dedicated multipliers, and 264 I/Os makes it suitable for applications requiring moderate on-chip processing alongside extensive external interfacing.

For teams building commercial electronic products, this device delivers a well-documented platform-level feature set and component-level specifications that simplify system partitioning, reduce external component count, and support reliable operation across standard commercial temperature ranges.

Request a quote or submit an inquiry to get pricing, availability, and integration support for the XC2V500-4FGG456C.

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