XC2V500-4FGG456C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 264 589824 456-BBGA |
|---|---|
| Quantity | 768 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 264 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC2V500-4FGG456C – Virtex®-II FPGA, 456-BBGA, 264 I/O
The XC2V500-4FGG456C is a Virtex®-II field programmable gate array (FPGA) in a 456-ball BGA package designed for commercial-grade applications. The device integrates a substantial logic fabric, embedded RAM, and a high I/O count to support complex digital functions such as memory interfaces, signal processing, and custom logic implementation.
Built on the Virtex-II platform architecture, this FPGA combines configurable logic blocks, dedicated multiplier resources, and flexible I/O to address designs that require on-chip processing, external memory interfacing, and moderate-speed programmable logic.
Key Features
- Configurable Logic — 768 configurable logic blocks (CLBs) providing 6,912 logic cells, enabling substantial combinational and sequential logic implementation.
- On‑Chip Memory — Approximately 0.59 Mbits of embedded RAM (589,824 total RAM bits) for FIFOs, buffers, and local data storage.
- Arithmetic Resources — Dedicated 18-bit × 18-bit multiplier blocks (Virtex‑II series feature) for efficient hardware multiplication and DSP tasks.
- I/O Capacity — 264 user I/Os to support broad peripheral connectivity and parallel interfaces.
- Logic Density — Device-level equivalent of 500,000 gates for mapping complex logic and state machines.
- Package and Mounting — 456-ball fine-pitch BGA (456-BBGA, supplier package 456-FBGA 23×23) with surface-mount mounting type for compact board integration.
- Power and Supply — Core supply voltage range of 1.425 V to 1.575 V for stable VccINT operation.
- Operating Conditions — Commercial grade with operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.
Typical Applications
- Memory Interfaces and Controllers — Use the device’s embedded RAM and high-speed I/O capability to build SDR/DDR and SRAM interface logic and custom memory controllers.
- Digital Signal Processing — Leverage dedicated 18×18 multipliers and on-chip RAM for filters, transforms, and other real-time DSP blocks.
- Custom Protocol and Bridge Logic — Implement protocol conversion, bus bridging, and glue logic using abundant logic cells and 264 I/O pins for external connectivity.
Unique Advantages
- Balanced Logic and Memory: The combination of 6,912 logic cells and approximately 0.59 Mbits of embedded RAM supports mixed control and data-path functions on a single device.
- Dedicated DSP Support: 18×18 multipliers provide hardware-accelerated arithmetic, reducing the need for external DSP components.
- High I/O Count: 264 user I/Os enable wide parallel interfaces and flexible board-level integration without multiplexing compromises.
- Compact BGA Package: 456-ball FBGA (23×23) minimizes PCB area while preserving high pin count for dense designs.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for typical commercial product requirements.
Why Choose XC2V500-4FGG456C?
The XC2V500-4FGG456C positions itself as a practical Virtex‑II platform FPGA for designs that need a solid balance of logic density, embedded memory, DSP capabilities, and broad I/O. Its combination of 768 CLBs (6,912 logic cells), dedicated multipliers, and 264 I/Os makes it suitable for applications requiring moderate on-chip processing alongside extensive external interfacing.
For teams building commercial electronic products, this device delivers a well-documented platform-level feature set and component-level specifications that simplify system partitioning, reduce external component count, and support reliable operation across standard commercial temperature ranges.
Request a quote or submit an inquiry to get pricing, availability, and integration support for the XC2V500-4FGG456C.

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