XC2V500-5FGG256C

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 589824 256-BGA

Quantity 1,601 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6912
Number of Gates500000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC2V500-5FGG256C – Virtex®-II Field Programmable Gate Array (FPGA) IC 172 I/O, 256-BGA

The XC2V500-5FGG256C is a Virtex®-II platform FPGA in a 256-ball fine-pitch BGA package, offered in a commercial-grade 0 °C to 85 °C temperature range. This device provides a balanced mix of programmable logic, on-chip RAM and I/O resources for mid-density FPGA designs.

Built on the Virtex-II architecture, the device pairs 6,912 logic elements with approximately 0.59 Mbits of embedded memory and 172 user I/Os, making it suitable for applications that require moderate logic density, embedded memory and flexible interfacing while operating from a 1.425 V to 1.575 V core supply.

Key Features

  • Logic Capacity  6,912 logic elements supporting complex combinational and sequential logic implementations.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for data buffering, FIFOs and small on-chip storage.
  • User I/O  172 user I/Os available in the 256-BGA package, supporting a variety of interface topologies and board-level routing.
  • Virtex-II Platform Capabilities  Series-level features include SelectRAM memory hierarchy, 18-bit × 18-bit multiplier blocks, Digitally Controlled Impedance (DCI) I/O, and advanced clock management (series documentation references Digital Clock Manager modules).
  • Package & Mounting  256-ball fine-pitch BGA (supplier device package: 256-FBGA, 17×17); surface-mount mounting type for standard PCB assembly.
  • Power and Supply  Core voltage supply range from 1.425 V to 1.575 V to match system power planning and regulator selection.
  • Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental compliance.

Typical Applications

  • Memory Interface Controllers  Implement DRAM/SDRAM controller logic and data buffering using the device’s on-chip RAM and available I/O resources.
  • Digital Signal Processing  Leverage the Virtex-II platform’s multiplier blocks and logic resources for fixed-function or custom DSP pipelines.
  • High-Speed I/O Bridging  Use the device’s SelectIO and DCI-capable I/Os to connect disparate high-speed peripherals and adapt signaling levels on-board.
  • Prototyping and Custom Logic  Suitable for hardware prototyping, algorithm offload and custom logic tasks where moderate gate count and embedded RAM are needed.

Unique Advantages

  • Balanced Integration: Combines 6,912 logic elements with ~0.59 Mbits of on-chip RAM and 172 I/Os to reduce external components and simplify board design.
  • Flexible I/O Architecture: A substantial number of user I/Os in a 256-BGA package supports diverse interfacing options and board-level routing flexibility.
  • Configurable Clocking and DSP Support: Series-level Virtex-II features include dedicated multiplier blocks and clock management resources to support synchronous designs and arithmetic-heavy workloads.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial deployment and environmental requirements.
  • Standard Surface-Mount Package: 256-FBGA (17×17) package ensures compatibility with common assembly processes and dense PCB layouts.

Why Choose XC2V500-5FGG256C?

The XC2V500-5FGG256C positions itself as a mid-density Virtex-II FPGA that delivers a practical combination of logic resources, embedded memory and I/O in a compact 256-BGA footprint. Its electrical and thermal specs—1.425 V to 1.575 V core supply and 0 °C to 85 °C operating range—make it appropriate for commercial designs demanding reliable programmable logic and on-chip RAM.

Engineers selecting this device benefit from the Virtex-II platform’s documented architecture and feature set, enabling efficient implementation of memory interfaces, DSP blocks and custom logic while keeping board-level complexity and BOM count under control.

Request a quote or submit a purchase inquiry for the XC2V500-5FGG256C to evaluate availability and pricing for your design.

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