XC2V500-4FGG456I

IC FPGA 264 I/O 456FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 264 589824 456-BBGA

Quantity 722 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O264Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6912
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC2V500-4FGG456I – Virtex®-II Field Programmable Gate Array (FPGA) IC, 264 I/O, ~0.59 Mbits RAM, 456-BBGA

The XC2V500-4FGG456I is a Virtex®-II platform Field Programmable Gate Array offering a mid-range mix of logic, embedded memory, and I/O in a 456-ball BGA package. It provides programmable logic resources together with embedded SelectRAM memory and dedicated arithmetic blocks for designs that require on-chip memory, high-speed I/O, and deterministic clocking.

Designed for industrial-grade applications, the device combines approximately 6,912 logic elements with 589,824 bits of on-chip RAM and 264 user I/Os to support system functions such as memory interfaces, signal processing blocks, and custom control logic while operating across a wide temperature and voltage range.

Key Features

  • Logic Resources  Approximately 6,912 logic elements with 768 CLB structures reported in device specifications for mid-range programmable logic capacity.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) organized as block SelectRAM resources suitable for data buffering and small on-chip storage.
  • Arithmetic Blocks  Dedicated 18-bit × 18-bit multiplier blocks for implementing DSP and multiply-accumulate functions efficiently within the fabric.
  • Clock Management  Digital Clock Manager (DCM) resources and global clock multiplexing features described in the Virtex-II platform for precise clock de-skew, frequency synthesis, and phase shifting.
  • I/O Capacity and Flexibility  264 user I/Os to support multiple external interfaces; SelectIO features in the Virtex-II family provide a range of I/O standards and programmable drive/termination options.
  • Package and Mounting  456-BBGA (supplier package 456-FBGA, 23×23) surface-mount package for high-density board designs.
  • Power and Temperature  Specified supply voltage range of 1.425 V to 1.575 V and industrial operating temperature range from −40 °C to 100 °C.
  • Industrial Grade and Compliance  Device is listed as Industrial grade and is RoHS compliant.
  • Series-Level Capabilities  Virtex-II platform features (from the series datasheet) include SelectRAM memory hierarchy, high-performance external memory interfaces (SDR/DDR and SRAM families), and architecture elements to support predictable routing and timing.

Typical Applications

  • Memory Interface Controllers  Use the device to implement SDR/DDR or SRAM interface logic and custom memory controllers leveraging the series’ high-performance external memory interface features.
  • Signal Processing and DSP  Leverage the dedicated 18×18 multipliers and on-chip RAM to build filtering, accumulation, and other arithmetic-intensive blocks.
  • Custom Logic and Glue  Deploy the FPGA as a programmable glue logic or protocol bridge where 264 I/Os and flexible logic resources are used to interface disparate peripherals and subsystems.
  • Industrial Control  Industrial operating temperature range and robust packaging make the device suitable for embedded control, motor drive interfacing, and industrial automation logic functions.

Unique Advantages

  • Balanced Logic-to-Memory Ratio:  Approximately 6,912 logic elements paired with ~0.59 Mbits of on-chip RAM provides a balanced platform for combined control and data buffering tasks.
  • Dedicated DSP Resources:  Built-in 18×18 multipliers reduce external component count and simplify implementation of multiply-accumulate and signal processing functions.
  • Deterministic Clocking:  Digital Clock Manager resources enable precise clock de-skew and phase/frequency adjustments for timing-critical designs.
  • High I/O Count:  264 user I/Os provide flexibility to connect multiple peripherals, memory devices, and board-level signals without external multiplexers.
  • Industrial Temperature Range:  Rated from −40 °C to 100 °C to meet harsher environmental requirements encountered in industrial deployments.
  • RoHS Compliant:  Meets lead-free requirements for environmentally conscious manufacturing processes.

Why Choose XC2V500-4FGG456I?

The XC2V500-4FGG456I places a practical combination of logic, embedded memory, DSP blocks, and high I/O count into a compact 456-BBGA footprint, offering engineers a versatile mid-range Virtex-II solution for industrial and embedded designs. With series-level features such as SelectRAM memory hierarchy, dedicated multipliers, and DCM-based clock management, the device supports designs that require reliable timing, local buffering, and arithmetic acceleration.

This part is well suited to teams building custom memory controllers, signal-processing pipelines, or complex glue logic where a balance of on-chip resources and industrial operating range provides design headroom and long-term robustness. Series-level tool and platform support noted in the datasheet helps integrate the device into established FPGA development flows.

Request a quote or submit an inquiry to check pricing and availability for XC2V500-4FGG456I and to discuss lead times or volume requirements.

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