XC2V500-5FGG456C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 264 589824 456-BBGA |
|---|---|
| Quantity | 211 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 264 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC2V500-5FGG456C – Virtex®-II Field Programmable Gate Array (FPGA) IC 264 589824 456-BBGA
The XC2V500-5FGG456C is a Virtex®-II platform field programmable gate array offered in a 456-ball fine-pitch BGA package. It delivers a balance of programmable logic, embedded memory, and I/O capacity for mid-range digital designs that require on-chip RAM, dedicated arithmetic resources, and flexible I/O.
Designed for commercial-grade applications, the device provides a comprehensive set of architecture features from the Virtex-II family—including dedicated multiplier blocks and clock management—that support complex custom logic, memory interfaces and signal processing tasks.
Key Features
- Logic Resources 768 configurable logic blocks (CLBs) providing a total of 6,912 logic elements (cells) for implementing custom logic and control functions.
- Embedded Memory Approximately 0.59 Mbits of on-chip RAM (589,824 bits) to support buffering, lookup tables and local data storage.
- Dedicated Arithmetic Series-level support for 18-bit × 18-bit multiplier blocks for efficient implementation of DSP and arithmetic-intensive functions.
- I/O Capacity & Flexibility 264 user I/Os in a fine-pitch BGA package, enabling a wide range of external interfaces and parallel connections for memory and peripherals.
- Clock and Timing Virtex-II platform clock-management features including Digital Clock Manager (DCM) modules for precise clocking and phase control (series capability).
- Power & Supply Nominal core supply range from 1.425 V to 1.575 V to match system power rails and ensure stable core operation.
- Package & Mounting 456-ball fine-pitch BGA (456-BBGA / supplier package 456-FBGA 23×23) with surface-mount mounting for compact board implementations.
- Commercial Temperature Range Rated for operation from 0 °C to 85 °C (commercial grade).
- Regulatory RoHS compliant.
Typical Applications
- Memory Interface and Bridge Use the device’s I/O capacity and embedded memory to implement DRAM/SRAM interface logic, buffering and protocol bridging.
- Signal Processing and DSP Acceleration Leverage the dedicated multiplier blocks and internal RAM for filtering, transforms and arithmetic-accelerated datapaths.
- Custom Logic and Control Implement glue logic, state machines and control systems where a reprogrammable, on-board logic fabric is required.
- Prototyping and System Integration Fast iteration of system-level functions and integration of multiple digital subsystems onto a single FPGA device.
Unique Advantages
- Balanced Logic and Memory: 768 CLBs and roughly 0.59 Mbits of embedded RAM provide a mix of resources suitable for mid-density designs without external memory dependence.
- Built-in Arithmetic Support: Dedicated 18×18 multiplier capability reduces the need for resource-heavy multiplier implementations in logic, improving performance for DSP tasks.
- Flexible I/O Count: 264 user I/Os in a compact BGA package enable multiple parallel interfaces and direct connections to peripherals or memory devices.
- Commercial Operating Range: Specified operation from 0 °C to 85 °C and RoHS compliance ease integration into commercial products and assemblies.
- Compact, Surface-Mount Package: The 456-ball FBGA (23×23) package supports high pin-count routing in space-constrained board layouts.
- Platform Toolchain Support: The Virtex-II family is supported by established development systems for HDL-based design and implementation (series-level tool support noted in the datasheet).
Why Choose XC2V500-5FGG456C?
The XC2V500-5FGG456C positions itself as a capable mid-range Virtex-II FPGA that combines programmable logic density, embedded memory and arithmetic resources with a flexible I/O complement. Its commercial temperature rating, RoHS compliance and compact 456-BBGA package make it a practical choice for products and prototypes that need on-chip memory and DSP capabilities without stepping up to larger device families.
This device is well suited for engineers designing memory interfaces, custom datapaths, or system glue logic who require a balanced set of resources and established platform-level tool support from the Virtex-II family.
Request a quote or submit an inquiry to receive availability, pricing and ordering information for the XC2V500-5FGG456C.

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