XC2V500-5FGG456I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 264 589824 456-BBGA |
|---|---|
| Quantity | 542 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 264 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC2V500-5FGG456I – Virtex®-II FPGA, 264 I/O, approximately 0.59 Mbits embedded RAM, 456-BBGA
The XC2V500-5FGG456I is a Virtex®-II field programmable gate array (FPGA) in a 456-ball BGA package designed for industrial applications. It combines a mid-range logic capacity with substantial embedded RAM and a broad I/O complement to support complex control, interface, and data-processing functions.
Built on the Virtex-II platform, this device targets applications that require flexible hardware programmability, moderate gate density, and extended temperature operation. Key value propositions include measurable logic resources, abundant on-chip memory, and a 23×23 fine-pitch BGA footprint for high-density board designs.
Key Features
- Logic Capacity — 6,912 logic elements and 768 configurable logic blocks (CLBs) provide programmable resources for control, state machines, and custom datapaths.
- Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, FIFOs, and local data storage.
- I/O — 264 user I/Os enable wide-ranging external interfaces and parallel connectivity for peripherals and memory devices.
- Package & Mounting — 456-BBGA (supplier package: 456-FBGA, 23×23) surface-mount package that supports dense PCB integration.
- Voltage & Power — Core supply range of 1.425 V to 1.575 V to match system power rails and regulator designs.
- Thermal & Reliability — Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Device Scale — Approximately 500,000 system gates for moderate-complexity FPGA designs.
- Standards & Compliance — RoHS-compliant material composition.
- Virtex-II Platform Technologies — Series-level architecture includes SelectRAM™ block RAM resources (18-Kb blocks), dedicated 18×18 multipliers, and digital clock management features described in the Virtex®-II documentation.
Typical Applications
- Industrial Control — Implement machine control logic, custom state machines, and deterministic I/O handling across wide temperature ranges.
- Data Acquisition & Buffering — Use embedded RAM and abundant I/O to capture, buffer, and pre-process sensor or instrumentation data before transfer to a host.
- Interface Bridging — Act as a programmable bridge between parallel and serial peripherals or as a glue-logic replacement to consolidate discrete ICs.
- Custom DSP & Arithmetic — Leverage on-chip multipliers and logic elements for fixed-point signal processing and arithmetic-accelerated functions.
Unique Advantages
- Moderate Logic & Memory Balance: 6,912 logic elements combined with ~0.59 Mbits of RAM supports mixed control and data buffering workloads without external SRAM for many designs.
- High I/O Count: 264 user I/Os provide flexibility to connect to multiple peripherals, memory devices, and sensors simultaneously, reducing external interface components.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial and harsh-environment installations.
- Compact, High-Density Packaging: 456-BBGA (23×23) footprint enables high-density PCB layouts and minimizes board area for space-constrained systems.
- Platform-Level FPGA Features: The Virtex-II architecture brings block RAM, dedicated multipliers, and clock-management features—enabling designers to build timing-critical and memory-intensive functions on-chip.
- RoHS Compliance: Environmentally compliant materials simplify regulatory and manufacturing considerations.
Why Choose XC2V500-5FGG456I?
The XC2V500-5FGG456I positions itself as a practical mid-range Virtex®-II FPGA choice for engineers who need a balance of programmable logic, embedded RAM, and high I/O density in an industrial-grade package. Its specifications support a broad class of embedded, control, and interface-centric designs where on-chip memory and plentiful I/Os reduce component count and board complexity.
For teams developing robust, scalable hardware, this device offers long-term value through the Virtex-II platform capabilities reported in the product documentation and the proven package and thermal ratings suited to industrial deployments.
Request a quote or submit your inquiry to get pricing, availability, and design support information for the XC2V500-5FGG456I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








