XC2V6000-4FF1152I

The XC2V6000-4FF1152I is a Virtex®-II Field Programmable Gate Array (FPGA) from AMD in a 1152-FCBGA package. It delivers a high-density, configurable logic platform with 8,448 CLBs and 76,032 logic elements suitable for complex digital designs.

Engineered for industrial applications, the device offers approximately 2.65 Mbits of embedded RAM, 6,000,000 gates of logic capacity, a broad I/O count (824 pins), and robust operating margins (1.425–1.575 V supply, –40 °C to 100 °C). It is targeted at designs requiring high integration of logic, memory and I/O in a single FPGA package.

Key Features

• Core Logic — 8,448 CLBs and 76,032 logic elements provide substantial programmable logic resources for complex combinational and sequential functions.
• On-chip Memory — Total embedded memory of approximately 2.65 Mbits in block SelectRAM resources for data buffering, FIFOs, and state storage.
• Arithmetic Primitives — Dedicated 18-bit × 18-bit multiplier blocks for efficient implementation of DSP and arithmetic-intensive functions.
• I/O Capacity and Technology — 824 user I/Os and SelectIO™ technology with Digitally Controlled Impedance (DCI) support enable versatile interfacing and on‑chip termination options.
• Clock Management — Digital Clock Manager (DCM) circuitry and global clock routing features (as described in the Virtex-II platform) enable flexible clock deskewing and frequency synthesis for multi‑clock designs.
• Package & Mounting — 1152-FCBGA (35 × 35 mm) flip‑chip BGA package, surface-mount ready to support high-density board designs.
• Electrical & Thermal — Supply range 1.425 V to 1.575 V with industrial operating temperature from –40 °C to 100 °C for deployment in challenging environments.
• Platform Capabilities — Virtex-II architecture features (selectable in the platform datasheet) such as SelectRAM hierarchy, high-performance routing, and I/O signaling options to support a range of interface standards and memory topologies.
• Standards & Compliance — RoHS compliant.

Typical Applications

• High‑performance memory interfaces — Ideal for FPGA-based controllers that require extensive on-chip RAM and dedicated interfaces to external DRAM/SRAM topologies.
• Signal processing and DSP — Dedicated 18×18 multipliers and large on-chip RAM make this device suitable for filtering, transforms, and other arithmetic‑heavy tasks.
• I/O‑intensive embedded systems — With 824 user I/Os and SelectIO support, the device suits applications that need wide or diverse external connectivity.
• Industrial control and automation — Industrial temperature grade and high gate count are appropriate for complex control logic and sensor/actuator interfacing in industrial environments.

Unique Advantages

• High logic density: 8,448 CLBs and 76,032 logic elements allow consolidation of large designs into a single FPGA, reducing system complexity.
• Substantial embedded memory: Approximately 2.65 Mbits of on‑chip RAM supports deep buffering, state machines, and local data storage without immediate external memory dependence.
• Rich I/O flexibility: 824 user I/Os with SelectIO and DCI capabilities enable robust signal integrity options and broad protocol support on the physical layer.
• Designed for industrial environments: –40 °C to 100 °C operating range and surface‑mount 1152-FCBGA packaging support demanding deployment scenarios.
• Dedicated arithmetic resources: Built‑in 18×18 multipliers lower logic utilization for math-heavy functions and accelerate DSP implementations.
• Platform-level clock features: Virtex‑II DCM and global clock resources facilitate precise clock management across large, multi‑clock designs.

Why Choose XC2V6000-4FF1152I?

The XC2V6000-4FF1152I positions itself as a high-density Virtex‑II FPGA aimed at industrial and performance-oriented embedded designs. Its combination of tens of thousands of logic elements, dedicated multiplier primitives, and several megabits of embedded RAM lets engineers implement complex custom logic, DSP functions, and memory interfaces within a single package.

Choose this device when you need a scalable, robust FPGA platform with broad I/O capability and industrial temperature rating. The Virtex‑II architecture and feature set provide long-term flexibility for designs that may evolve in functionality or require reliable operation across challenging thermal environments.

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