XC2V6000-4FFG1517C

IC FPGA 1104 I/O 1517FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 1104 2654208 1517-BBGA, FCBGA

Quantity 889 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O1104Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-4FFG1517C – Virtex®-II FPGA, 1517-FCBGA, 1104 I/O

The XC2V6000-4FFG1517C is a Virtex®-II Field Programmable Gate Array (FPGA) in a 1517-FCBGA package offering a high-density programmable fabric for complex digital designs. It delivers 76,032 logic elements (LEs), approximately 2.65 Mbits of embedded memory and a large 1,104-pin I/O count to address demanding logic, memory-interface and DSP-oriented applications.

Built for commercial-grade deployments, this surface-mount FPGA combines on-chip memory, dedicated arithmetic resources and advanced I/O capability with a 1.425 V–1.575 V core supply and an operating range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  76,032 logic elements and a device gate-equivalent count of 6,000,000 provide the capacity for large, integrated digital designs.
  • Embedded Memory  Approximately 2.65 Mbits of on-chip RAM, leveraging 18-Kb block SelectRAM resources for dual-port memory and distributed memory structures.
  • High I/O Density  1,104 user I/Os in a 1517-FCBGA (40×40) package support extensive external interfacing and board-level connectivity with surface-mount mounting.
  • Dedicated DSP Blocks  Includes 18-bit × 18-bit multiplier resources suitable for arithmetic and signal-processing functions as described in the Virtex-II architecture.
  • Clock Management  Supports the Virtex-II Digital Clock Manager (DCM) capability for clock de-skew, frequency synthesis and phase shifting as part of the device family feature set.
  • SelectIO and I/O Features  Virtex-II SelectIO technology provides flexible I/O standards and on-chip termination options, plus programmable drive and impedance control described in the platform specification.
  • Power and Packaging  Operates from a 1.425 V to 1.575 V core supply; supplied in a 1517-BBGA/1517-FCBGA package suitable for surface-mount assembly.
  • Commercial Grade and Compliance  Commercial-grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Typical Applications

  • Memory Interface and Controller Design  Large on-chip RAM and extensive I/O make the device well-suited for implementing high-performance DRAM/SRAM interface logic and memory controllers.
  • High-Bandwidth Data Paths  High I/O count and SelectIO features enable wide, high-speed data buses and parallel data-path implementations.
  • DSP and Signal Processing  Dedicated 18×18 multipliers and abundant embedded memory support arithmetic-intensive blocks such as filters, transforms and packet processing pipelines.
  • System Integration and Glue Logic  Substantial logic capacity and flexible I/O simplify integration of complex glue logic, protocol bridging and custom accelerators within one FPGA.

Unique Advantages

  • High Integration: Consolidates large logic, memory and I/O requirements into a single 1517-FCBGA package, reducing external component count.
  • Scalable On-Chip Memory: Approximately 2.65 Mbits of embedded RAM across 18-Kb block resources enables efficient implementation of dual-port memory and buffering.
  • DSP-Ready Resources: Built-in 18-bit × 18-bit multipliers accelerate common signal-processing operations without external ASICs.
  • Flexible I/O Capabilities: 1,104 I/Os and SelectIO platform features provide support for diverse interface standards and on-chip impedance control for board-level signal integrity.
  • Robust Clocking Options: Virtex-II Digital Clock Manager features enable precise clock control and phase/frequency management for complex timing domains.
  • Commercial and RoHS-Compliant: Designed for commercial deployment with RoHS compliance and a standard 0 °C to 85 °C operating range.

Why Choose XC2V6000-4FFG1517C?

The XC2V6000-4FFG1517C positions itself as a high-capacity Virtex®-II FPGA ideal for designers who need significant logic density, substantial on-chip memory and a very high I/O count in a single, surface-mount FCBGA package. Its combination of logic elements, dedicated multipliers and SelectRAM resources addresses complex digital signal processing, memory-controller and high-throughput interface requirements.

For commercial projects requiring a proven FPGA platform with flexible I/O, embedded memory and clock-management capabilities, this device provides a balanced solution that simplifies board-level design and supports advanced system integration.

Request a quote or submit a procurement inquiry to check availability and lead-times for the XC2V6000-4FFG1517C.

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