XC2V6000-5FF1152I

IC FPGA 824 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 824 2654208 1152-BBGA, FCBGA

Quantity 1,162 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O824Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-5FF1152I – Virtex®-II FPGA, 1152-FCBGA (35×35), Industrial

The XC2V6000-5FF1152I is a Virtex®-II field programmable gate array (FPGA) supplied by AMD, offered in a 1152-pin flip-chip fine-pitch BGA package. This device provides a high-density programmable fabric with significant on-chip memory and a large I/O complement for demanding embedded and system-level designs.

With 8,448 configurable logic blocks, approximately 76,032 logic elements, roughly 2.65 Mbits of embedded RAM, and 824 user I/Os, the XC2V6000-5FF1152I targets applications requiring substantial logic capacity, extensive I/O connectivity, and reliable operation across an industrial temperature range.

Key Features

  • Logic Capacity — 8,448 configurable logic blocks (CLBs) delivering 76,032 logic elements for complex digital designs and large-scale integration.
  • Embedded Memory — Approximately 2.65 Mbits of on-chip RAM to support buffering, packet storage, and local memory for compute kernels.
  • High I/O Count — 824 user I/Os to interface with multiple external devices, memory systems, and high-density connectors.
  • Arithmetic Resources — Dedicated multiplier and arithmetic capabilities described in the Virtex®-II family documentation to accelerate DSP and math-intensive tasks.
  • Clock Management — Series-level digital clock management features referenced in the Virtex®-II documentation for flexible clock synthesis and deskewing in multi-clock designs.
  • Interconnect and Routing — Virtex®-II platform routing architecture for predictable routing delays and high-performance signal paths.
  • Package & Mounting — 1152-FCBGA (35×35 mm) flip-chip BGA, surface-mount package suitable for compact, high-density board designs.
  • Power and Temperature — Core supply range 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C for industrial environments.
  • Compliance — RoHS compliant.
  • System Capacity — Approximately 6,000,000 system gates as defined for the device family.

Typical Applications

  • Memory Interface Controllers — Large logic capacity and embedded RAM make the device suitable for implementing SDR/DDR and other memory controllers described in the Virtex®-II family documentation.
  • High-Bandwidth Data Paths — High I/O count and series-level SelectIO capabilities support designs requiring wide parallel or high-speed serialized data transfer.
  • Digital Signal Processing — Dedicated multiplier blocks and ample logic elements enable multiply-accumulate and DSP pipeline implementations.
  • System Integration — Use as a central programmable logic hub to consolidate glue logic, protocol bridging, and custom accelerators in industrial systems.

Unique Advantages

  • High Logic Density: 8,448 CLBs and 76,032 logic elements enable large, integrated designs without partitioning across multiple devices.
  • Substantial On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces external memory dependence and improves latency for buffering and local storage.
  • Extensive I/O: 824 user I/Os simplify interfacing to multiple peripherals, front-end modules, and memory devices, lowering board-level complexity.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C to support operation in a wide range of industrial environments.
  • RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.
  • Compact, Surface-Mount Package: 1152-FCBGA (35×35) flip-chip BGA supports high-density PCB layouts while maintaining thermal and signal integrity for complex designs.

Why Choose XC2V6000-5FF1152I?

The XC2V6000-5FF1152I combines large logic capacity, significant embedded memory, and a high I/O count in a single industrial-grade FCBGA package. It is well suited for engineers and system designers who need to integrate complex control logic, memory interfaces, and DSP functions without splitting the design across multiple devices.

For organizations focused on scalable, robust FPGA-based solutions, this device offers a balance of system-level integration and proven series-level features that support a wide range of industrial and high-performance embedded applications.

Request a quote or submit a pricing request to receive availability and ordering information for the XC2V6000-5FF1152I. Our team can provide lead-time and quantity pricing to support your procurement process.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up