XC2V6000-5FFG1517C

IC FPGA 1104 I/O 1517FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 1104 2654208 1517-BBGA, FCBGA

Quantity 842 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O1104Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-5FFG1517C – Virtex®-II Field Programmable Gate Array (FPGA), 1517-FCBGA

The XC2V6000-5FFG1517C is a Virtex®-II platform FPGA packaged in a 1517‑FCBGA (40×40) surface-mount package. It delivers high logic density and on-chip memory for demanding digital designs and system-level integration.

Designed for commercial-temperature applications, this device combines 76,032 logic elements, approximately 2.65 Mbits of embedded memory, and 1,104 user I/Os to support complex processing, high-bandwidth interfaces and memory-centric applications.

Key Features

  • Logic Density 76,032 logic elements providing substantial programmable fabric for complex logic, control and datapath implementations.
  • Configurable Logic Blocks (CLBs) 8,448 CLBs for routing flexible logic functions and register resources.
  • Embedded RAM Approximately 2.65 Mbits of on-chip RAM in 18-Kb block SelectRAM resources for buffers, FIFOs and on-chip storage.
  • Arithmetic Resources Dedicated 18‑bit × 18‑bit multiplier blocks (as described in the Virtex‑II platform) to accelerate DSP and signal-processing tasks.
  • I/O Capacity & Standards 1,104 user I/Os with SelectIO™ capabilities and support for multiple single‑ended and differential I/O standards, enabling high-speed external memory and link interfaces.
  • Clock Management Multiple Digital Clock Manager (DCM) modules and global clock buffers (platform feature) to support precise clocking and frequency synthesis.
  • Performance & Gate Count Equivalent to approximately 6,000,000 system gates, enabling implementation of large, integrated systems on a single device.
  • Power and Supply Core supply voltage range 1.425 V to 1.575 V.
  • Package & Mounting 1517‑FCBGA (40×40) package; surface-mount mounting for standard PCB assembly workflows.
  • Temperature Grade Commercial grade operation from 0 °C to 85 °C.
  • Compliance RoHS‑compliant.

Typical Applications

  • High‑Performance Data Processing — Use the device’s large logic capacity and embedded RAM for packet processing, real‑time analytics and complex control algorithms.
  • Memory Interface and Controllers — Built‑in support for high‑performance DRAM/SRAM interfaces and selectable I/O standards enables implementation of DRAM, SRAM and QDR interface logic.
  • Signal Processing and DSP — Dedicated multiplier blocks and abundant on‑chip memory are well suited to filtering, transforms and other numeric-intensive workloads.
  • High‑Speed I/O and Interconnects — Extensive I/O count and SelectIO features support LVDS, PCI/PCI‑X class interfaces and other high‑bandwidth link implementations.

Unique Advantages

  • High Integration: 76,032 logic elements and approximately 2.65 Mbits of embedded RAM reduce external components and simplify board-level design.
  • Flexible I/O and Memory Interfaces: 1,104 user I/Os and platform I/O features enable a wide range of external memory and link topologies without substantial redesign.
  • Dedicated DSP Primitives: Hardware multipliers and CLB resources accelerate arithmetic and signal-processing functions, shortening development time for DSP applications.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match commercial-grade system requirements.
  • Established Platform Support: The device is part of the Virtex‑II platform with documented architecture and development tool support referenced in the product datasheet.

Why Choose XC2V6000-5FFG1517C?

The XC2V6000-5FFG1517C combines high logic capacity, substantial embedded memory and a large user I/O complement in a 1517‑FCBGA package, making it well suited for complex system designs that require integrated DSP, memory interfacing and high-throughput data paths. Its commercial temperature rating and RoHS compliance fit standard production environments.

As a member of the Virtex‑II family with documented platform features and development-tool support, this FPGA provides a stable foundation for scalable designs that demand substantial programmable resources and flexible I/O implementation.

Request a quote or submit an inquiry to receive pricing, availability and assistance tailoring the XC2V6000-5FFG1517C to your design requirements.

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