XC2V6000-5FFG1152C

IC FPGA 824 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 824 2654208 1152-BBGA, FCBGA

Quantity 71 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O824Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-5FFG1152C – Virtex®-II FPGA, 1152-FCBGA

The XC2V6000-5FFG1152C is a Virtex®-II field programmable gate array (FPGA) in a 1152‑pin flip‑chip FCBGA package, designed for high‑density digital logic integration. Built for commercial applications, this device combines substantial logic capacity, embedded memory, and a large number of I/O to support complex system designs such as high‑performance interfaces, custom datapaths, and memory controller logic.

Architected around the Virtex‑II platform, the device delivers flexible on‑chip resources and clock management features that enable designers to consolidate functions into a single programmable device while maintaining precise timing and interface control.

Key Features

  • Logic Capacity  Provides 76,032 logic elements and approximately 6,000,000 system gates for implementing complex combinational and sequential logic.
  • Embedded Memory  Approximately 2.65 Mbits of on‑chip RAM (Total RAM Bits: 2,654,208) suitable for buffering, FIFOs, and distributed memory needs.
  • I/O Density  824 user I/Os to support wide parallel interfaces and multiple external memory or peripheral connections.
  • Dedicated Arithmetic Resources  Includes 18‑bit × 18‑bit multiplier blocks as part of the Virtex‑II feature set for efficient implementation of DSP and arithmetic functions.
  • Clock Management  Digital Clock Manager (DCM) functionality in the Virtex‑II family provides precise clock de‑skew, frequency synthesis, and phase shifting for robust timing across the design.
  • Memory Hierarchy  18‑Kb block SelectRAM resources and distributed SelectRAM options enable flexible memory architecture on the device.
  • Power and Supply  Operates from a core voltage supply range of 1.425 V to 1.575 V.
  • Package and Mounting  Supplied in a 1152‑FCBGA (35 × 35 mm) surface‑mount package for high‑density board integration.
  • Commercial Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
  • Standards and I/O Capabilities (Platform)  Virtex‑II platform features include a broad set of I/O standards, programmable sink currents, and support for differential signaling and high‑speed serial/parallel interfaces.

Typical Applications

  • Network and Communications  Implements custom packet processing, protocol bridging, and high‑speed interface logic using the device's large logic and I/O resources.
  • Memory Interface Controllers  Serves as a bridge or controller for SDR/DDR memory interfaces leveraging on‑chip block RAM and dedicated timing resources.
  • Signal Processing and DSP  Uses embedded multipliers and ample logic to implement filters, transforms, and custom arithmetic pipelines.
  • System Integration  Consolidates multiple glue‑logic and peripheral functions into a single FPGA to reduce board complexity and bill of materials.

Unique Advantages

  • High logic and gate count: Enables complex designs with 76,032 logic elements and roughly 6 million system gates, reducing the need for multiple devices.
  • Significant embedded memory: Approximately 2.65 Mbits of on‑chip RAM supports deep buffering and efficient data handling without external memory for many functions.
  • Large I/O complement: 824 user I/Os accommodate wide buses and multiple peripheral or memory interfaces directly from the FPGA.
  • Advanced clocking and arithmetic: Platform DCMs and 18×18 multipliers deliver precise timing control and efficient arithmetic acceleration for high‑performance designs.
  • Compact board footprint: 1152‑FCBGA surface‑mount package offers high pin count in a compact 35 × 35 mm form factor for dense PCB layouts.
  • Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployment and environmental compliance.

Why Choose XC2V6000-5FFG1152C?

The XC2V6000-5FFG1152C positions itself as a high‑capacity, commercially rated Virtex‑II FPGA suited to designs that require extensive logic, plentiful embedded memory, and a large number of I/Os in a single device. Its platform features—such as block SelectRAM resources, dedicated multipliers, and clock management—help engineers implement complex datapaths and interface logic while maintaining precise timing control.

This device is ideal for teams looking to consolidate multiple functions into one FPGA to simplify board design and reduce component count, while retaining the flexibility of field programmability and the support of the Virtex‑II architecture.

Request a quote or submit an inquiry to receive pricing and availability for the XC2V6000-5FFG1152C and to discuss how it fits into your next design.

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