XC2V6000-5FFG1152I

The XC2V6000-5FFG1152I is a Virtex®-II FPGA in a 1152-ball flip-chip BGA package designed for industrial applications. It combines a high-density programmable fabric with substantial on-chip memory and a large I/O count to support complex logic integration, high‑bandwidth interfaces and memory-intensive tasks.

Built on the Virtex‑II platform, this device is well suited for system-level functions such as custom logic acceleration, memory interface control and high-performance I/O routing where a mix of integration, configurability and industrial temperature operation (-40 °C to 100 °C) is required.

Key Features

• Programmable Logic Density — Provides 76,032 logic elements (reported logic cells) and an estimated 6,000,000 system gates for implementing large, complex designs.
• On‑Chip Memory — Approximately 2.65 Mbits of embedded memory (Total RAM Bits: 2,654,208) to support buffering, lookup tables and distributed RAM requirements.
• High I/O Count — 824 user I/Os enable wide external interfaces and multiple parallel data paths from a single device.
• Arithmetic and DSP Resources — Virtex‑II platform includes dedicated multiplier blocks and arithmetic resources (series feature) suitable for signal processing and algorithm acceleration.
• Advanced I/O and Routing Architecture — Implements the Virtex‑II SelectIO and segmented routing technologies (series feature) to support diverse I/O standards and predictable routing performance.
• Package and Mounting — 1152-FCBGA (35×35 mm) flip‑chip BGA package, surface-mount mounting type, optimized for compact board-level integration.
• Power and Supply — Core supply range 1.425 V to 1.575 V to match typical Virtex‑II core voltage requirements.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C for demanding environmental conditions.
• Regulatory — RoHS compliant for lead-free assembly processes.

Typical Applications

• High‑Performance Memory Interfaces — Implement SDR/DDR and specialized memory controllers using the device’s on-chip RAM and wide I/O resources.
• Signal Processing and DSP — Use dedicated arithmetic blocks and large logic resources for filtering, modulation, and other DSP tasks.
• Networking and Data Transport — Leverage high I/O counts and the Virtex‑II I/O architecture for packet processing, protocol bridging and custom interface logic.
• System Prototyping and Integration — Consolidate multiple functions into a single FPGA to reduce BOM and accelerate development of complex embedded systems.

Unique Advantages

• High integration density: 76,032 logic elements and ~2.65 Mbits of embedded memory enable consolidation of complex functions into one device, reducing board-level component count.
• Broad I/O capability: 824 user I/Os provide flexibility for wide parallel buses, multiple high-speed interfaces or mixed-signal front ends.
• Industrial reliability: Rated for -40 °C to 100 °C operation and supplied in a robust flip‑chip BGA package for demanding environments.
• Configurable performance: Virtex‑II architecture (series features) offers dedicated multipliers, memory hierarchy and advanced clock management to tailor performance to application needs.
• RoHS compliant: Supports lead‑free manufacturing flows for modern assembly processes.

Why Choose XC2V6000-5FFG1152I?

The XC2V6000-5FFG1152I delivers a balance of high logic density, substantial embedded memory and a large I/O complement in a single industrial-grade FCBGA package. It is designed for engineers who need to implement complex system functions—such as memory controllers, DSP algorithms and multi-interface bridging—while maintaining board-level integration and environmental robustness.

Choosing this Virtex‑II device provides a scalable platform backed by the series’ architectural capabilities, enabling long-term reuse across prototypes and production systems where configurability and performance are essential.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC2V6000-5FFG1152I.