XC2V6000-5FFG1517I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 1104 2654208 1517-BBGA, FCBGA |
|---|---|
| Quantity | 440 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 1104 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8448 | Number of Logic Elements/Cells | 76032 | ||
| Number of Gates | 6000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2654208 |
Overview of XC2V6000-5FFG1517I – Virtex®-II FPGA, 1517-FCBGA, Industrial
The XC2V6000-5FFG1517I is a Virtex®-II field programmable gate array (FPGA) in a 1517-FCBGA (40×40) package. It provides a high-density, reprogrammable logic platform combining large logic capacity, embedded memory, and extensive I/O for industrial applications.
This device targets designs that require substantial on-chip logic and memory, flexible high-speed I/O, and robust clock management. It is supplied in a surface-mount, industrial-grade package with a specified operating range and RoHS compliance.
Key Features
- Logic Capacity — Approximately 76,032 logic elements to implement complex custom logic and control functions.
- Configurable Logic Blocks (CLBs) — Large CLB structure matched to the device logic capacity for scalable designs.
- Embedded Memory — Approximately 2.65 Mbits of on-chip RAM, delivered through block SelectRAM resources for high-performance data buffering and storage.
- Dedicated DSP Resources — Integrated 18‑bit × 18‑bit multiplier blocks for arithmetic and signal-processing functions.
- I/O Density — 1,104 user I/Os to support wide data buses, parallel interfaces, and high pin-count system connectivity.
- Clock Management — On-chip clock management features, including Digital Clock Manager (DCM) modules and global clock multiplexing, for precise clocking and deskew.
- Package & Mounting — 1517‑BBGA / 1517‑FCBGA (40×40) ball-grid array; surface-mount package suited for PCB assembly.
- Power & Voltage — Core supply range specified at 1.425 V to 1.575 V for predictable power integration.
- Temperature Range & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High‑performance memory interfaces — Use embedded RAM and high I/O count to implement SDR/DDR or SRAM interface logic and buffering.
- Protocol bridging and packet processing — Large logic element count and dense I/O support complex protocol conversion and data-path processing.
- Industrial control and automation — Industrial temperature grade and extensive I/O make the device suitable for deterministic control, sensor aggregation, and machine interfaces.
- Digital signal processing — Dedicated multiplier blocks and substantial on-chip RAM enable arithmetic-heavy functions and real-time data manipulation.
Unique Advantages
- High integration: Combines tens of thousands of logic elements and megabits of embedded RAM in a single FPGA, reducing external component count and board complexity.
- Flexible I/O bandwidth: Over one thousand user I/Os provide broad options for parallel interfaces, wide buses, and multi-lane connectivity.
- Built-in clock control: Integrated clock management resources simplify multi-clock-domain designs and timing alignment without external PLCs.
- Industrial robustness: Specified operating temperature down to −40 °C and up to 100 °C supports deployments in industrial environments.
- Predictable power requirements: A defined core voltage range enables straightforward power-supply design and margin planning.
- Standards‑aware architecture: The Virtex‑II platform includes features such as block SelectRAM and dedicated multipliers that accelerate common memory and DSP functions.
Why Choose XC2V6000-5FFG1517I?
The XC2V6000-5FFG1517I positions itself as a high-density Virtex‑II FPGA option for industrial designs that demand substantial logic, embedded memory, and extensive I/O. Its combination of approximately 76,032 logic elements, around 2.65 Mbits of embedded RAM, and 1,104 I/Os delivers the building blocks for complex control, interfacing, and signal-processing applications.
Engineers specifying this device benefit from predictable electrical and thermal parameters (core voltage 1.425–1.575 V, operating −40 °C to 100 °C), a compact 1517‑FCBGA package for surface-mount assembly, and RoHS compliance—making it suitable for long-life industrial deployments where scalability and platform-level features matter.
Request a quote or submit a purchase inquiry to evaluate XC2V6000-5FFG1517I for your next design and to confirm availability and lead times.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








