XC2V6000-5FFG1517I

IC FPGA 1104 I/O 1517FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 1104 2654208 1517-BBGA, FCBGA

Quantity 440 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O1104Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-5FFG1517I – Virtex®-II FPGA, 1517-FCBGA, Industrial

The XC2V6000-5FFG1517I is a Virtex®-II field programmable gate array (FPGA) in a 1517-FCBGA (40×40) package. It provides a high-density, reprogrammable logic platform combining large logic capacity, embedded memory, and extensive I/O for industrial applications.

This device targets designs that require substantial on-chip logic and memory, flexible high-speed I/O, and robust clock management. It is supplied in a surface-mount, industrial-grade package with a specified operating range and RoHS compliance.

Key Features

  • Logic Capacity — Approximately 76,032 logic elements to implement complex custom logic and control functions.
  • Configurable Logic Blocks (CLBs) — Large CLB structure matched to the device logic capacity for scalable designs.
  • Embedded Memory — Approximately 2.65 Mbits of on-chip RAM, delivered through block SelectRAM resources for high-performance data buffering and storage.
  • Dedicated DSP Resources — Integrated 18‑bit × 18‑bit multiplier blocks for arithmetic and signal-processing functions.
  • I/O Density — 1,104 user I/Os to support wide data buses, parallel interfaces, and high pin-count system connectivity.
  • Clock Management — On-chip clock management features, including Digital Clock Manager (DCM) modules and global clock multiplexing, for precise clocking and deskew.
  • Package & Mounting — 1517‑BBGA / 1517‑FCBGA (40×40) ball-grid array; surface-mount package suited for PCB assembly.
  • Power & Voltage — Core supply range specified at 1.425 V to 1.575 V for predictable power integration.
  • Temperature Range & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • High‑performance memory interfaces — Use embedded RAM and high I/O count to implement SDR/DDR or SRAM interface logic and buffering.
  • Protocol bridging and packet processing — Large logic element count and dense I/O support complex protocol conversion and data-path processing.
  • Industrial control and automation — Industrial temperature grade and extensive I/O make the device suitable for deterministic control, sensor aggregation, and machine interfaces.
  • Digital signal processing — Dedicated multiplier blocks and substantial on-chip RAM enable arithmetic-heavy functions and real-time data manipulation.

Unique Advantages

  • High integration: Combines tens of thousands of logic elements and megabits of embedded RAM in a single FPGA, reducing external component count and board complexity.
  • Flexible I/O bandwidth: Over one thousand user I/Os provide broad options for parallel interfaces, wide buses, and multi-lane connectivity.
  • Built-in clock control: Integrated clock management resources simplify multi-clock-domain designs and timing alignment without external PLCs.
  • Industrial robustness: Specified operating temperature down to −40 °C and up to 100 °C supports deployments in industrial environments.
  • Predictable power requirements: A defined core voltage range enables straightforward power-supply design and margin planning.
  • Standards‑aware architecture: The Virtex‑II platform includes features such as block SelectRAM and dedicated multipliers that accelerate common memory and DSP functions.

Why Choose XC2V6000-5FFG1517I?

The XC2V6000-5FFG1517I positions itself as a high-density Virtex‑II FPGA option for industrial designs that demand substantial logic, embedded memory, and extensive I/O. Its combination of approximately 76,032 logic elements, around 2.65 Mbits of embedded RAM, and 1,104 I/Os delivers the building blocks for complex control, interfacing, and signal-processing applications.

Engineers specifying this device benefit from predictable electrical and thermal parameters (core voltage 1.425–1.575 V, operating −40 °C to 100 °C), a compact 1517‑FCBGA package for surface-mount assembly, and RoHS compliance—making it suitable for long-life industrial deployments where scalability and platform-level features matter.

Request a quote or submit a purchase inquiry to evaluate XC2V6000-5FFG1517I for your next design and to confirm availability and lead times.

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