XC2V6000-4FFG1517I

IC FPGA 1104 I/O 1517FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 1104 2654208 1517-BBGA, FCBGA

Quantity 46 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O1104Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-4FFG1517I – Virtex®-II Field Programmable Gate Array (FPGA) IC

The XC2V6000-4FFG1517I is a Virtex®-II family FPGA offered in a 1517-FCBGA (40×40) package for surface-mount assembly. It provides a high-density programmable fabric with substantial on-chip memory and I/O resources for industrial-grade embedded and system designs.

Designed for applications that require large logic capacity, extensive I/O, and robust clocking and arithmetic resources, this device delivers a combination of integration and flexibility suitable for memory interfaces, DSP acceleration, and high-bandwidth I/O tasks.

Key Features

  • Logic Capacity  Approximately 76,032 logic elements (cells) providing the equivalent of around 6,000,000 system gates for complex logic integration.
  • Embedded Memory  Approximately 2.65 Mbits of on-chip RAM (2,654,208 bits) with support for 18-Kbit SelectRAM block resources as described in the Virtex-II family documentation.
  • Dedicated Arithmetic Resources  Includes dedicated 18‑bit × 18‑bit multiplier blocks to accelerate DSP and arithmetic-intensive functions.
  • I/O Density and Standards  1104 user I/Os with support for multiple single-ended and differential signaling standards, programmable sink currents, Digitally Controlled Impedance (DCI) on I/O, and high-speed differential options including LVDS and LVPECL as defined for the Virtex‑II family.
  • Clock Management  High-performance clock management features from the Virtex‑II platform, including Digital Clock Manager (DCM) modules and global clock multiplexer buffers to support precise clocking and frequency synthesis.
  • Memory and External Interfaces  Platform-level support for high-performance DRAM and SRAM interfaces (SDR/DDR, network FCRAM, QDR provisioned in family documentation) for efficient external memory integration.
  • Package, Power and Thermal  1517‑BBGA / 1517‑FCBGA (40×40) package in a surface-mount format; nominal supply range 1.425 V to 1.575 V; operating temperature range −40 °C to 100 °C.
  • Industrial Grade & Compliance  Specified as Industrial grade and RoHS compliant for environmentally regulated assemblies.

Typical Applications

  • High‑performance memory interfaces  Implement complex SDR/DDR and specialized DRAM controllers using the device’s memory hierarchy and high‑bandwidth I/O resources.
  • DSP and signal processing  Leverage dedicated 18×18 multipliers and abundant logic elements to accelerate filtering, transforms, and real‑time arithmetic workloads.
  • High‑density I/O bridging and protocol handling  Use the large number of user I/Os and configurable signaling options to implement protocol converters, data aggregators, and interface bridges.
  • System prototyping and integration  Deploy as a programmable system component for integrating logic, memory controllers, and custom peripherals in industrial applications.

Unique Advantages

  • High integration density: The combination of ~76,032 logic elements and ~2.65 Mbits of embedded RAM reduces the need for multiple discrete devices and simplifies board-level design.
  • Extensive I/O capability: 1104 user I/Os with programmable I/O features and DCI enable flexible interfacing to a wide range of external devices and signaling standards.
  • Built for arithmetic-heavy tasks: Dedicated 18×18 multipliers accelerate DSP workloads and reduce logic resource consumption for math-intensive functions.
  • Robust clocking and timing control: Digital Clock Manager modules and global clock muxes (platform features) provide precise clock de‑skew and flexible frequency synthesis for complex timing domains.
  • Industrial reliability: Industrial-grade specification and an extended operating temperature range (−40 °C to 100 °C) support deployment in demanding environments.
  • Standards and ecosystem support: Architecture and feature set align with the Virtex‑II family documentation for proven design flows and integration practices.

Why Choose XC2V6000-4FFG1517I?

The XC2V6000-4FFG1517I combines high logic capacity, substantial embedded memory, and a large, configurable I/O fabric in a compact 1517‑FCBGA package. Its industrial-grade temperature range and RoHS compliance make it suited for production systems that require reliable, high-density programmable logic.

This device is appropriate for designers building memory interfaces, DSP accelerators, high-bandwidth I/O subsystems, or integrated prototyping platforms who need the Virtex‑II family’s clocking, arithmetic, and SelectRAM capabilities within a surface-mount BGA package.

Request a quote or submit an RFQ to get pricing and availability for the XC2V6000-4FFG1517I and evaluate lead times for your production schedule.

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