XC2V6000-4FFG1152I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 824 2654208 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,133 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 824 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8448 | Number of Logic Elements/Cells | 76032 | ||
| Number of Gates | 6000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2654208 |
Overview of XC2V6000-4FFG1152I – Virtex®-II FPGA, 1152-FCBGA (Industrial)
The XC2V6000-4FFG1152I is a Virtex®-II Field Programmable Gate Array (FPGA) offered in a 1152-FCBGA (35×35) package for surface-mount applications. It provides a high-density, reprogrammable logic fabric suited for complex digital designs that require abundant logic, on-chip memory and extensive I/O.
Built on the Virtex-II architecture, the device targets applications that demand high I/O counts, embedded RAM and dedicated arithmetic resources while operating across an industrial temperature range. Its value proposition centers on integration of logic, memory and I/O to simplify system design and shorten development cycles.
Key Features
- High-density logic — 76,032 logic elements (cells) delivering the programmable fabric necessary for complex control, signal processing and glue-logic implementations.
- On-chip memory — Approximately 2.65 Mbits of embedded RAM (2,654,208 total RAM bits) and support for 18-Kb block SelectRAM resources as described in the Virtex-II platform specification.
- Dedicated arithmetic blocks — Series-level Virtex-II features include 18-bit × 18-bit multiplier blocks for arithmetic acceleration and DSP tasks.
- Extensive I/O — 824 user I/Os to support wide parallel interfaces, external memory buses and high-pin-count system integration.
- Performance and architecture — Virtex-II platform capability highlights (series-level) such as segmented routing and clocking resources including multiple digital clock manager (DCM) modules and global clock buffers.
- Logic capacity (gates) — Approximately 6,000,000 system gates, enabling large-scale integration on a single device.
- Package and mounting — 1152-FCBGA (35×35) package, surface-mount mounting type for modern PCB assembly.
- Voltage and temperature — Core supply range 1.425 V to 1.575 V; operating temperature −40 °C to 100 °C, suitable for industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- Memory interface controllers — Use the device’s abundant I/O and Virtex-II platform memory features to implement SDR/DDR DRAM and SRAM interfaces for buffering and high-throughput data paths.
- Signal processing and DSP acceleration — Leverage dedicated 18×18 multipliers and large logic resources for hardware acceleration of filters, transforms and other arithmetic-heavy functions.
- High-density I/O systems — 824 I/Os enable wide parallel data buses, protocol bridging and interface aggregation for communications and networking equipment.
- Complex control and glue logic — Large logic element count supports sophisticated control algorithms, peripheral integration and state machines in embedded systems.
Unique Advantages
- High integration density: 76,032 logic elements and ~6 million gates reduce external components and simplify board-level design.
- Significant embedded memory: Approximately 2.65 Mbits of on-chip RAM lowers external memory dependency for many buffering and scratchpad needs.
- Extensive connectivity: 824 user I/Os provide flexibility to implement wide buses, multiple interfaces or large-pin-count peripherals without multiplexing compromises.
- Industrial temperature capability: −40 °C to 100 °C rating supports deployment in industrial and ruggedized applications.
- Industry-standard packaging: 1152-FCBGA (35×35) surface-mount package facilitates high-density PCB integration and standard assembly processes.
- Platform-level tool support: Virtex-II platform documentation and development system support (series-level) enable established design flows for VHDL/Verilog projects.
Why Choose XC2V6000-4FFG1152I?
The XC2V6000-4FFG1152I combines a high logic count, substantial embedded RAM and a large I/O complement in a single industrial-temperature FPGA package. It is well suited to engineers designing high-throughput memory interfaces, DSP accelerators and control-intensive embedded systems who need a programmable, reconfigurable solution with proven platform features.
For teams seeking a scalable FPGA building block, this Virtex-II device offers a balance of logic capacity, on-chip memory and I/O density that supports medium- to high-complexity implementations while leveraging established platform documentation and development flows.
Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the XC2V6000-4FFG1152I. Our team can provide configurational details and support for your project requirements.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








