XC2V6000-4FFG1152I

IC FPGA 824 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 824 2654208 1152-BBGA, FCBGA

Quantity 1,133 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O824Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-4FFG1152I – Virtex®-II FPGA, 1152-FCBGA (Industrial)

The XC2V6000-4FFG1152I is a Virtex®-II Field Programmable Gate Array (FPGA) offered in a 1152-FCBGA (35×35) package for surface-mount applications. It provides a high-density, reprogrammable logic fabric suited for complex digital designs that require abundant logic, on-chip memory and extensive I/O.

Built on the Virtex-II architecture, the device targets applications that demand high I/O counts, embedded RAM and dedicated arithmetic resources while operating across an industrial temperature range. Its value proposition centers on integration of logic, memory and I/O to simplify system design and shorten development cycles.

Key Features

  • High-density logic — 76,032 logic elements (cells) delivering the programmable fabric necessary for complex control, signal processing and glue-logic implementations.
  • On-chip memory — Approximately 2.65 Mbits of embedded RAM (2,654,208 total RAM bits) and support for 18-Kb block SelectRAM resources as described in the Virtex-II platform specification.
  • Dedicated arithmetic blocks — Series-level Virtex-II features include 18-bit × 18-bit multiplier blocks for arithmetic acceleration and DSP tasks.
  • Extensive I/O — 824 user I/Os to support wide parallel interfaces, external memory buses and high-pin-count system integration.
  • Performance and architecture — Virtex-II platform capability highlights (series-level) such as segmented routing and clocking resources including multiple digital clock manager (DCM) modules and global clock buffers.
  • Logic capacity (gates) — Approximately 6,000,000 system gates, enabling large-scale integration on a single device.
  • Package and mounting — 1152-FCBGA (35×35) package, surface-mount mounting type for modern PCB assembly.
  • Voltage and temperature — Core supply range 1.425 V to 1.575 V; operating temperature −40 °C to 100 °C, suitable for industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Memory interface controllers — Use the device’s abundant I/O and Virtex-II platform memory features to implement SDR/DDR DRAM and SRAM interfaces for buffering and high-throughput data paths.
  • Signal processing and DSP acceleration — Leverage dedicated 18×18 multipliers and large logic resources for hardware acceleration of filters, transforms and other arithmetic-heavy functions.
  • High-density I/O systems — 824 I/Os enable wide parallel data buses, protocol bridging and interface aggregation for communications and networking equipment.
  • Complex control and glue logic — Large logic element count supports sophisticated control algorithms, peripheral integration and state machines in embedded systems.

Unique Advantages

  • High integration density: 76,032 logic elements and ~6 million gates reduce external components and simplify board-level design.
  • Significant embedded memory: Approximately 2.65 Mbits of on-chip RAM lowers external memory dependency for many buffering and scratchpad needs.
  • Extensive connectivity: 824 user I/Os provide flexibility to implement wide buses, multiple interfaces or large-pin-count peripherals without multiplexing compromises.
  • Industrial temperature capability: −40 °C to 100 °C rating supports deployment in industrial and ruggedized applications.
  • Industry-standard packaging: 1152-FCBGA (35×35) surface-mount package facilitates high-density PCB integration and standard assembly processes.
  • Platform-level tool support: Virtex-II platform documentation and development system support (series-level) enable established design flows for VHDL/Verilog projects.

Why Choose XC2V6000-4FFG1152I?

The XC2V6000-4FFG1152I combines a high logic count, substantial embedded RAM and a large I/O complement in a single industrial-temperature FPGA package. It is well suited to engineers designing high-throughput memory interfaces, DSP accelerators and control-intensive embedded systems who need a programmable, reconfigurable solution with proven platform features.

For teams seeking a scalable FPGA building block, this Virtex-II device offers a balance of logic capacity, on-chip memory and I/O density that supports medium- to high-complexity implementations while leveraging established platform documentation and development flows.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the XC2V6000-4FFG1152I. Our team can provide configurational details and support for your project requirements.

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