XC2V6000-4BF957C

IC FPGA 684 I/O 957FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 684 2654208 957-BBGA, FCBGA

Quantity 143 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package957-FCBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case957-BBGA, FCBGANumber of I/O684Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8448Number of Logic Elements/Cells76032
Number of Gates6000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC2V6000-4BF957C – Virtex®-II Field Programmable Gate Array (FPGA) IC 684 2654208 957-BBGA, FCBGA

The XC2V6000-4BF957C is a Virtex‑II platform FPGA offering high logic density and extensive on‑chip memory in a 957‑ball flip‑chip BGA package. It combines a large number of programmable logic elements, dedicated arithmetic resources and a rich I/O set to support designs that require complex custom logic, memory interfaces and high‑speed I/O.

Key attributes include approximately 76,032 logic elements, roughly 2.65 Mbits of embedded memory, 684 user I/Os and support for advanced clock management and multiplier resources — delivered in a commercial‑grade, surface‑mount 957‑FCBGA (40×40) package and RoHS‑compliant construction.

Key Features

  • Logic Capacity  Approximately 76,032 logic elements and about 6,000,000 system gates for implementing large, complex logic designs.
  • Embedded Memory  Approximately 2.65 Mbits of on‑chip RAM supporting SelectRAM memory hierarchy for dual‑port block RAM and distributed RAM structures.
  • I/O Density  684 user I/Os enabling a wide range of external interfaces and parallel connectivity for high‑pin‑count applications.
  • Arithmetic Resources  Includes dedicated 18‑bit × 18‑bit multiplier blocks suitable for DSP and arithmetic‑intensive functions (as described for the Virtex‑II family).
  • Clock Management  Digital Clock Manager (DCM) circuitry and global clock multiplexer buffers (family features) to support precise clock de‑skew, frequency synthesis and phase control.
  • High‑Performance Interfaces  Family‑level support for high‑performance DRAM and SRAM interfaces and a variety of signaling standards (listed in the Virtex‑II product specification).
  • Power and Voltage  Core supply operating range of 1.425 V to 1.575 V to match platform power requirements.
  • Package and Mounting  957‑ball flip‑chip BGA (957‑FCBGA, 40×40) surface‑mount package for compact, board‑level integration.
  • Commercial‑Grade & Compliance  Commercial operating temperature range of 0 °C to 85 °C and RoHS‑compliant construction.

Typical Applications

  • Memory Interface Controllers  High‑performance DRAM/SDR/DDR and SRAM interface designs leveraging the device’s SelectRAM resources and the Virtex‑II family’s memory interface capabilities.
  • DSP and Signal Processing  Signal processing blocks and numeric pipelines that use the dedicated 18×18 multipliers and abundant embedded RAM for buffering and computation.
  • High‑I/O Communication Systems  Systems requiring large numbers of parallel and high‑speed I/Os for protocol bridging, packet processing or custom I/O aggregation.
  • Custom Logic and Prototyping  Complex, application‑specific logic implementations that benefit from high gate and logic element counts in a single FPGA package.

Unique Advantages

  • High Logic Density:  Approximately 76,032 logic elements and 6,000,000 system gates enable implementation of large, integrated designs without partitioning across multiple devices.
  • Substantial Embedded Memory:  Approximately 2.65 Mbits of on‑chip RAM supports dual‑port block RAM and distributed RAM use cases, reducing dependence on external memory for many buffering tasks.
  • Extensive I/O Resources:  684 user I/Os provide flexibility to connect to a wide variety of peripherals, memory devices and board‑level interfaces.
  • Dedicated Arithmetic Blocks:  18×18 multipliers accelerate DSP and arithmetic workloads, reducing logic resource usage for multiply‑intensive functions.
  • Robust Clocking Tools:  Digital Clock Manager features and global clock buffers (family features) enable precise clock distribution, de‑skew and flexible frequency management within designs.
  • Compact BGA Package:  957‑ball FCBGA (40×40) delivers a high I/O count in a surface‑mount footprint suitable for dense PCB implementations.

Why Choose XC2V6000-4BF957C?

The XC2V6000-4BF957C positions itself as a high‑density Virtex‑II FPGA option for designs that demand a balance of logic capacity, embedded memory and a large I/O complement in a single commercial‑grade package. Its combination of approximately 76,032 logic elements, around 2.65 Mbits of embedded RAM, dedicated multiplier blocks and extensive clock management features matches applications that require on‑chip compute, buffering and flexible interfacing.

Backed by the Virtex‑II family architecture and the associated design tool support described in the product specification, this device is suited to engineering teams implementing memory controllers, DSP pipelines, high‑I/O communications logic or other complex programmable logic systems where consolidation and integration reduce board‑level complexity.

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