XC2V6000-4FFG1152C

The XC2V6000-4FFG1152C is a Virtex®-II field programmable gate array supplied in a 1152‑ball flip‑chip fine‑pitch BGA (1152‑FCBGA, 35×35) surface‑mount package. This high‑density FPGA integrates substantial logic and on‑chip memory with a large I/O complement for system designs that require flexible hardware acceleration, high‑bandwidth interfaces, and complex glue logic.

With 76,032 logic elements (8,448 CLBs), approximately 2.654 Mbits of embedded memory and roughly 6,000,000 system gates, the device is positioned for applications that demand significant programmable logic, memory resources and extensive I/O connectivity within a commercial operating temperature range.

Key Features

• Core Logic  8,448 CLBs and 76,032 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 2.654 Mbits of on‑chip RAM (total RAM bits: 2,654,208) suitable for buffers, FIFOs and embedded data storage.
• Arithmetic & DSP Primitives  Series documentation highlights dedicated 18‑bit × 18‑bit multiplier blocks and fast carry logic for arithmetic and DSP functions.
• I/O Density & Standards  824 user I/O pins with SelectIO™‑Ultra capabilities reported in the platform data, enabling a wide range of single‑ended and differential I/O standards and high‑speed interfaces.
• Clocking & Timing  Platform features include multiple Digital Clock Manager (DCM) modules and global clock buffers for flexible clock distribution and deskew (as described in the series documentation).
• Package & Mounting  1152‑ball FCBGA (35×35) package, surface‑mount mounting for high‑density board integration.
• Power & Supply  Operating core supply range: 1.425 V to 1.575 V, enabling precise power provisioning for the FPGA core.
• Operating Conditions  Commercial‑grade operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High‑speed memory interfaces  Use the device’s embedded memory and I/O capabilities to implement SDR/DDR and other DRAM/SRAM interface logic and buffering.
• Digital signal processing  Leverage the dedicated multiplier blocks and extensive logic resources for DSP acceleration, filtering and real‑time data processing.
• Prototyping and system integration  High logic density and large I/O count make this FPGA suitable for complex prototype platforms, board‑level integration and glue logic consolidation.
• I/O‑intensive controllers  Implement high‑pin‑count bridging, protocol conversion and multi‑lane data routing using the device’s broad I/O complement.

Unique Advantages

• High programmable capacity: 76,032 logic elements and 8,448 CLBs provide the headroom needed for large combinational and sequential designs without immediate rearchitecture.
• Substantial on‑chip memory: Approximately 2.654 Mbits of embedded RAM reduces external memory dependency for many buffering and storage needs.
• Large I/O footprint: 824 I/O pins enable dense board-level interfacing and multi‑channel connectivity, simplifying system partitioning.
• Flexible clocking ecosystem: Platform clock management features facilitate precise clock distribution, phase control and deskew for timing‑sensitive applications.
• Commercial temperature rating: Rated for 0 °C to 85 °C to meet a wide range of standard commercial electronic applications.
• RoHS compliant: Conforms to RoHS requirements to support regulatory and manufacturing supply needs.

Why Choose XC2V6000-4FFG1152C?

The XC2V6000-4FFG1152C combines high logic density, significant embedded memory and a large I/O complement in a compact 1152‑FCBGA package, delivering a versatile platform for designs that require integrated processing, buffering and extensive connectivity. Its commercial temperature rating and RoHS compliance support production deployment in standard electronics applications.

This FPGA is suited to development teams and systems integrators tackling high‑capacity logic implementations, memory‑intensive interfaces, and I/O‑heavy subsystems that benefit from the Virtex‑II platform’s documented clocking, DSP and I/O capabilities.

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